Island-embedded chip packaging structure with upright radiating block and external heating panel

Abstract

The invention relates to an island-embedded chip packaging structure with an upright radiating block and an external heating panel, which comprises a chip (3), a metal island (1), metal internal pins (4), metal wires (5), a conducting or non-conducting heat conduction adhesive material I (2) arranged between the chip and the metal island and a plastic-sealed body (8), wherein the metal island (1) is embedded in the plastic-sealed body (8). The island-embedded chip packaging structure is characterized in that the radiating block (7) is arranged above the chip (3), and a conducting or non-conducting heat conduction adhesive material II (6) is embedded between the radiating block (7) and the chip (3); the radiating block (7) exposes out of but not protrudes from the plastic-sealed body (8); the heating panel (11) is arranged above the radiating block (7) and a conducting or non-conducting heat conduction adhesive material III (13) is embedded between the heating panel (11) and the radiating block (7). The packaging structure can provide strong heat dissipation capability.

Description

(1) Technical field [0001] The invention relates to a packaging structure of a chip embedded in a base island with a heat dissipation block and an external heat dissipation plate. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet used (such as figure 1 and figure 2 As shown), the effective area and volume of the metal-based island are very ...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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