Package structure of heat radiating plate externally connected with island embedded chip pyramid locking hole heat radiating block convex cylinder

Abstract

The invention relates to a package structure of a heat radiating plate externally connected with an island embedded chip pyramid locking hole heat radiating block convex cylinder, comprising a chip (3), a metal island (1), a metal inner pin (4), a metal wire (5), a conductive or nonconductive heat conduction bonding substance I (2) and a plastic package body (8), wherein the metal island (1) is embedded in the plastic package body (8); a heat radiating block (7) with a locking hole (7.1) is arranged above the chip (3), and a conductive or nonconductive heat conduction bonding substance II (6) is embedded between the heat radiating block (7) and the chip (3); the heat radiating plate (11) is arranged above the heat radiating block (7) and is in splicing connection with the heat radiating block (7) through a convex cylinder (11.1). The package structure can provide strong heat radiating capacity so that the heat of the chip can be fast transferred outside the package body, and avoids rapid aging, even burning or damaging of the chip.

Description

The base island is embedded in the chip, and the locking hole is mounted. (1) Technical field The invention relates to a package structure of a base island embedded in a chip and a heat dissipation block protruding column externally connected to a heat dissipation plate in a locking hole. It belongs to the technical field of semiconductor packaging. (2) Background technology The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: 1. The metal base island is too small In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. The metal inner feet are used (as shown in Fi...

AI Technical Summary

Problems solved by technology

In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and the metal-based islands are fixed by thin support rods at the left and right or four corners. Or support the metal-based island, and because of the characteristics of the thin support rods, the heat absorbed by the metal-based island from the chip cannot be quickly conducted from the thin support rods, so the heat of the chip cannot or quickly conduction to the outside of the package, resulting in rapid aging of the life of the chip or even burns or burnout

3. Metal base island exposed type (as shown in Figure 3 and Figure 4)

Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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