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Method and apparatus of holding a device

A device and wafer technology, applied in the field of wafer clamps and pressure control structures, which can solve problems such as defects, wafer defect stress, IC failure, etc.

Active Publication Date: 2013-04-24
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, current wafer fixtures may cause wafer defects such as stress defects or air bubble defects, which may cause the IC to fail or be unusable
Thus, while existing wafer holding devices generally serve their purpose, they have not been fully satisfactory in every respect.

Method used

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  • Method and apparatus of holding a device
  • Method and apparatus of holding a device
  • Method and apparatus of holding a device

Examples

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Embodiment Construction

[0011] It will be appreciated that the following description presents many different embodiments, for example, for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the description. Of course, these are examples only and are not meant to be limiting. In addition, the structure in which the first feature is on or above the second feature in the following description may include embodiments in which the first and second features are in direct contact, and may also include embodiments in which additional features are formed between the first and second features. For example, such first and second features may not be in direct contact. Various features are arbitrarily drawn in different scales for simplicity and clarity.

[0012] figure 1 A flow diagram of a method 100 for independently and selectively varying fluid pressure in each of a plurality of holes in a wafer chuck is shown in accordance wi...

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PUM

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Abstract

Provided is an apparatus and a method of holding a device. The apparatus includes a wafer chuck having first and second holes that extend therethrough, and a pressure control structure that can independently and selectively vary a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure. The method includes providing a wafer chuck having first and second holes that extend therethrough, and independently and selectively varying a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure.

Description

technical field [0001] The present invention relates generally to fixtures, and more particularly to wafer clamps and pressure control structures. Background technique [0002] The semiconductor integrated circuit (IC) industry has experienced rapid development in recent years. Technological advances in IC materials and design have produced generations of ICs, each with smaller and more complex circuits than the previous generation. These ICs are typically manufactured by processing semiconductor wafers. Processing of semiconductor wafers may require securing the semiconductor wafer with devices such as wafer clamps. However, current wafer holding devices may cause wafer defects such as stress defects or air bubble defects, which may cause the IC to fail or be unusable. Thus, while existing wafer holding devices generally serve their purpose, they have not been fully satisfactory in every respect. Contents of the invention [0003] One of the broader forms of the inven...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/302H01L21/71
CPCH01L21/6838H01L21/304
Inventor 刘丙寅喻中一许哲颖杜友伦周大翔蔡嘉雄
Owner TAIWAN SEMICON MFG CO LTD