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Circuit substrate

A circuit substrate and power supply technology, which is applied in the direction of circuits, electrical components, electric solid-state devices, etc., can solve the problems of affecting signal impedance and incomplete power supply

Active Publication Date: 2012-05-23
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The disadvantage of this known circuit substrate 1 is that, since the power / ground plane 12 is an important source of power or ground signals, the grid holes 122 covered on it will affect the signal impedance of the power or ground, which may make the power supply not whole

Method used

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  • Circuit substrate
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Embodiment Construction

[0041] figure 2 It is a schematic top view showing a circuit substrate with grid holes in the power / ground plane of the present invention. refer to figure 2 , in this embodiment, the circuit substrate 2 is a windowed ball grid array (WINDOWBALL GRID ARRAY, WBGA) packaging substrate, but it can be understood that the circuit substrate 2 can also be other forms of circuit substrates, which can be Single-layer substrate or multi-layer substrate. The circuit substrate 2 includes a first conductive layer 20 . The first conductive layer 20 includes an opening 21 , a plurality of power / ground planes (Power / Ground Plane) 22 and lines. The circuit includes a plurality of conductive fingers (Finger) 23, a plurality of input / output ball pads (I / O Ball Pad) 24, a plurality of power / ground ball pads (Power / Ground Ball Pad) 25 and a plurality of conductive traces ( Conductive Trace) 26. The conductive fingers 23 are located on the periphery of the window 21 .

[0042] The I / O ball p...

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PUM

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Abstract

The invention discloses a circuit substrate, comprising a first conductive layer, wherein the first conductive layer comprises at least one power supply / grounding plane which is provided with at least one plane edge and a plurality of grid lines; each grid line is provided with a line width; the grid lines are mutually staggered and defined into a plurality of first grid holes; the distance between the first grid hole closest to the plane edge and the plane edge is 1.5 times greater than the line width, therefore, the influence of the first grid hole on power supply and grounding impedances is reduced to the lowest so as to solve the problem of the completeness of the power supply and reduce the generation of heat.

Description

technical field [0001] The invention relates to a circuit substrate, in particular to a circuit substrate with grid holes on a power supply / ground plane. Background technique [0002] figure 1 It is a schematic top view showing a known circuit substrate. refer to figure 1 , the known circuit substrate 1 is a windowed ball grid array (WINDOW BALL GRID ARRAY, WBGA) packaging substrate, which includes a window 11, a plurality of power / ground planes (Power / Ground Plane) 12, a plurality of conductive fingers ( Finger) 13, a plurality of input / output ball pads (I / O Ball Pad) 14, a power / ground ball pad (Power / Ground Ball Pad) 15 and a plurality of conductive traces (Conductive Trace) 16. The conductive fingers 13 are located on the periphery of the window 11 . Each power / ground plane 12 has a plurality of grid lines 121 intersecting with each other to define a plurality of grid holes 122 . The power / ground plane 12 is made of copper, and a large area of ​​copper is etched to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/498H01L23/12
Inventor 郑宏祥黄志亿
Owner ADVANCED SEMICON ENG INC