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Thermoelectric element

A technology of thermoelectric components and resistance devices, applied in the directions of thermoelectric devices, electrical components, thermoelectric device components, etc., can solve the problem of no components

Inactive Publication Date: 2010-10-13
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of a series connection, if there is a problem with one of the TE semiconductor or metal layers, the entire component will not perform optimally

Method used

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Examples

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Embodiment Construction

[0030] Exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0031] However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the shapes and dimensions may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like components.

[0032] figure 2 is a schematic cross-sectional view showing a thermoelectric element according to an exemplary embodiment of the present invention. The thermoelectric (TE) element 100 of the present embodiment includes: n-type TE semiconductor 101 and p-type TE semiconductor 102, n-type TE semiconductor 101 and p-type TE semiconductor 102 form a pn junction, ...

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Abstract

There is provided a thermoelectric (TE) element. The TE element includes a plurality of pn junctions each formed by bonding an n-type TE semiconductor and a p-type TE semiconductor with a metallic layer interposed therebetween, and a first electrode and a second electrode electrically connected to the n-type TE semiconductor and the p-type TE semiconductor, respectively. The plurality of pn junctions are laminated with insulating layers interposed therebetween, and are connected electrically in parallel to each other. Even in the case that a section of components does not operate electrically, the operation of the entire element is not adversely affected, thereby improving stability of the TE element.

Description

[0001] This application claims priority from Korean Patent Application No. 2009-0031784 filed with the Korean Intellectual Property Office on Apr. 13, 2009, the disclosure of which is hereby incorporated by reference. technical field [0002] The present invention relates to a thermoelectric element with improved stability and thermoelectric efficiency. Background technique [0003] Global warming and the depletion of existing energy supplies are of concern due to the rapid growth of fossil fuel energy use. This raises the focus on thermoelectric (TE) elements. The TE element is used as a cooling device in place of freon gas or the like that causes air pollution. In addition, TE elements are widely used as small generators utilizing the Seebeck effect. Specifically, when a loop is formed by interconnecting metals with a semiconductor (TE semiconductor) as a medium and a current flows through the loop, a potential difference is generated by a difference in Fermi energy. At...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/00H01L35/12H01L25/00
CPCH01L23/38H01L35/32H01L2924/0002H10N10/17H01L2924/00H10N10/80H10N10/01
Inventor 李圣镐吴龙洙郑粲烨
Owner SAMSUNG ELECTRO MECHANICS CO LTD