Full implanting board of printed circuit board and connecting method thereof
A technology for printed circuit boards and bonding methods, which is applied in the structural connection of printed circuits, printed circuit components, and printed circuit assembly of electrical components, and can solve the problems of large loss of material components, decreased utilization rate of SMT production lines, and defective sub-boards And other issues
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[0043] see figure 1 , the present invention provides a fully-planted printed circuit board and a bonding method thereof, the bonding method can carry out high-precision bonding of multiple printed circuit sub-boards and edge strips to form a fully-planted printed circuit board structure, The bonding method includes the following steps (see also Figure 2 to Figure 4A ):
[0044] Step S101 : providing a plurality of printed circuit sub-boards 11 and at least two side strips 12 . In this embodiment, the present invention combines four printed circuit boards 11 with two edge strips 12 , but it is not limited thereto.
[0045] Step S102: Use the camera module to locate the plurality of printed circuit sub-boards 11 and at least two side strips 12 on a carrier board (see figure 2). In this step, the present invention utilizes two camera modules to respectively extract the upper surface image and the lower surface image of the printed circuit sub-board 11 (which may also includ...
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Abstract
Description
Claims
Application Information
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