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Tin electroplating solution and tin electroplating method

An electrolytic tin and plating technology, applied in the field of electrolytic tin plating solution and electrolytic tin plating, can solve the problems of tin chipping and problems, and achieve the effect of smooth installation

Active Publication Date: 2012-07-18
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the plating solution of JP2002-47593 is used, tin shavings are generated, and there are problems in the overall installation, which will be described in the comparative example
[0005] Furthermore, tin plating of chip components is usually carried out using barrel plating, but during plating there is a problem that the chip components are coupled together, so-called "sticking"

Method used

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  • Tin electroplating solution and tin electroplating method
  • Tin electroplating solution and tin electroplating method
  • Tin electroplating solution and tin electroplating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1-12

[0045] Prepare a solution with the following composition as the main bath:

[0046] (A) stannous methanesulfonate (as tin ion): 15g / L

[0047] (B) Methanesulfonic acid (as free acid): 115g / L

[0048] (C) Sodium gluconate: 125g / L

[0049] (D) Potassium hydroquinone sulfonate: 2g / L

[0050] (E) Sodium hydroxide (pH regulator): 4.0g / L

[0051] (F) Distilled water: balance

[0052] Various nonionic surfactants listed in Table 1 below were added to the main bath at the concentrations listed in Table 2 to prepare the tin plating solutions of Embodiments 1-12. Thin-film battery tests were performed using 1 L of each tin plating solution under the conditions described below, and the appearance was evaluated. The results obtained are listed in Table 2.

[0053] Thin film test conditions:

[0054] Current density: 0.2A

[0055] Time: 10 minutes

[0056] Mixing: 4m / min

[0057] Bath temperature: 30°C

[0058] pH: 4.0

[0059] Table 1

[0060] Surfactant

Agent ...

Embodiment approach 13-20

[0067] Various nonionic surfactants were added to the same main bath as used for Embodiments 1-12 above, in the proportions listed in Table 4 below, to prepare the plating solutions for Embodiments 13-20. In addition, a conventional tin plating bath for chip components was used as a comparison.

[0068] Table 4: Samples used for tin shavings generation test

[0069]

[0070] The numbers of the surfactants shown in the table represent the numbers used for the surfactants listed in Table 1.

[0071] testing method

[0072] Tin plating was performed according to the following plating conditions and plating methods, each plating solution containing various surfactants. After plating, a spin test was performed to evaluate the ease of chipping from the tin film.

[0073] Plating conditions:

[0074] Current density: 0.2ASD

[0075] Time: 40 minutes

[0076] Concentration of tin in the plating solution (as tin ions): 15g / L

[0077] pH: 4

[0078] Temperature: 30°C

[0079...

Embodiment approach 21-29

[0100] The tin plating baths of Embodiments 21-29 were prepared by adding various surfactants at the concentrations shown in Table 7 to the same main bath as that used for Embodiments 1-12 above, using the same as shown in Embodiments 1-12 The appearance and film thickness distribution of the plated film were evaluated by the same method. The results are listed in Tables 8 and 9.

[0101] Table 7

[0102]

[0103] Table 8: Appearance of Thin Film Battery

[0104]

[0105] Table 9: Film Thickness Distributions Tested Using Thin Film Cells

[0106]

[0107] In addition, using the plating solutions of Embodiments 21-29, a spin test was performed in a similar manner to Embodiments 13-19 to determine the easiness of tin shavings. In addition, after tin plating, the blocking degree of the sample can also be confirmed. Sticking was confirmed by calculating the ratio of chip assemblies stuck together to the total number of chip assemblies. The results of the spin test and ...

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Abstract

Provided are a tin electroplating solution and a plating method for chip parts, which is less in chipped chaff under such a condition that tin-plated articles collide with each other during bulk mounting,and is less in the mutual sticking of chip parts.The tin electroplating solution contains (1) stannous ions, (2) a complexing agent, (3) a nonionic surfactant and (4) an antioxidant; the nonionicsurfactant contains a compound represented by general formula (A) and a compound represented by general formula (B), general formula (A): R-(C6H4)-RO(CH2CH2O)nH, wherein R represents a linear or branched chain alkyl containing carbon atoms of 1-20, n represents an integer from 1 to 10, general formula (B): HO(C2H4O)l-(C3H6O)m-(C2H4O)n-H, wherein l represents an integer from 1 to 10, m represents an integer from 1 to 10, n represents an integer from 1 to 10.

Description

technical field [0001] The present invention relates to an electrolytic tin plating solution and an electrolytic tin plating method, and further specifically relates to an electrolytic tin plating solution and an electrolytic tin plating method for chip components, and the solution and method are used for plating chip components , such as ceramic capacitors, etc. Background technique [0002] Chip components are getting smaller every year, and mounting forms have also changed in recent years, that is, mounting forms for bulk mounting systems have become mainstream. A total mounting system is an effective mounting system in which the packaging material being used is re-evaluated and chip components are provided from the time of re-evaluation until mounting. A bulk case (chip component packaging material for a bulk mounting system) is used as a package form, and a bulk feeder is used, which has the function of arranging random-oriented chip components in a row and supplying c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/32
CPCC25D3/32
Inventor 折桥正典
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC