Method and device for palm rejection

A touch device and palm technology, applied in the input/output process of data processing, instruments, electrical digital data processing, etc., can solve the problems of general products and methods without suitable structures and methods, high cost, inconvenience, etc.

Active Publication Date: 2011-01-26
EGALAX EMPIA TECH INC
View PDF2 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such a design requires twice as many conductive thin film structures, requiring higher cost
[0003] It can be seen that the above-mentioned existing touch device and method that ignores palm touch pressure obviously still have inconvenience and defects in product structure, method and use, and need to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for palm rejection
  • Method and device for palm rejection
  • Method and device for palm rejection

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation methods, Structure, method, step, feature and effect thereof are as follows in detail.

[0035] Some embodiments of the present invention will be described in detail as follows. However, in addition to the following descriptions, the present invention can also be widely implemented in other embodiments, and the protection scope of the present invention is not limited by the embodiments, which shall prevail by the protection scope of the claims. Moreover, in order to provide a clearer description and an easier understanding of the present invention, various parts in the drawings have not been drawn according to their relative sizes, and some dimensions have been exaggerated compared with other relevant dimensions; irrelevant details have not been completely drawn. are drawn for the sake of simplicity of the di...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention relates to a method and device for palm rejection. The present invention carries out palm rejection on a multi-touch panel. The panel is first touched by a palm before the detection of a finger or pen to define a rejection region and the touch location of the finger or pen is detected outside that rejection region. The present invention, when the rejection region and the touch location of the finger or pen have been detected, is able to continuously detecting a region touched by the palm using a detected range defined by the rejection region.

Description

technical field [0001] The present invention relates to a multi-point touch device and method, in particular to a multi-point touch device and method that ignores palm touch pressure. Background technique [0002] U.S. Patent No. US6628269 discloses a touch device that ignores the touch pressure of the palm. Compared with the traditional resistive touch device that uses a set of two-layer conductive films facing each other, this patent uses two sets of two-layer conductive films facing each other stacked up and down. film. A looser insulating spacer is used between the upper face-to-face conductive films, and a tighter insulating spacer is used between the lower face-to-face conductive films. Therefore, only the tip contact pressure can cause the two face-to-face conductive films below to contact, and the larger area The contact pressure (such as palm contact pressure) can only cause the two layers of conductive films on the upper surface to contact, so the contact pressure...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/042
CPCG06F3/0416G06F3/04186
Inventor 叶尚泰陈家铭
Owner EGALAX EMPIA TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap