Light-emitting diode packaging structure

A light-emitting diode and packaging structure technology, applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problem that the light source cannot be effectively concentrated, the light-emitting diode packaging component has no mechanism design, and the light cannot be accurately aligned with the lens design of the optical system of the projector, etc. problem, to achieve the effect of avoiding light divergence and good light utilization efficiency

Inactive Publication Date: 2012-11-28
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the technology of applying LED package components to projectors as a projection light source has not yet matured, because the general LED package components have a light divergence angle of about 110 to 120 degrees, and the LED package components have no special mechanism design Assembled in the projector, the light source emitted by the LED packaging component cannot be effectively concentrated, and the light cannot be accurately aligned with the lens design of the optical system of the projector, which affects the optical path design of the optical system and the effective use of the light source.

Method used

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  • Light-emitting diode packaging structure
  • Light-emitting diode packaging structure
  • Light-emitting diode packaging structure

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Embodiment Construction

[0023] Please refer to Figure 1 to Figure 3 , figure 1 , figure 2 and image 3 They are the upper side appearance schematic diagram, the cross-sectional schematic diagram and the lower side appearance schematic diagram of Embodiment 1 of the light emitting diode packaging structure of the present invention, respectively. The LED packaging structure 10 of the present invention can be applied in a projector to be used as a projection light source. The LED package structure 10 includes a package case 12 , at least one LED chip 14 , a transparent component 16 and a heat dissipation block 20 . The package case 12 has an upper surface 13 and a groove 18 , wherein the groove 18 is disposed on the upper surface 13 of the package case 12 , that is, the groove 18 is disposed in the package case 12 and exposed by the upper surface 13 . The groove 18 has a bottom surface 15 and an opening 25 . The heat dissipation block 20 is disposed on the bottom surface 15 of the groove 18 , ext...

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Abstract

The invention provides a light-emitting diode (LED) packaging structure, which comprises a shell, an LED, a transparent assembly and an enclosed wall. The shell is provided with an upper surface, a groove formed on the upper surface, and a surrounding surface surrounding an opening of the groove; the LED is arranged on a bottom surface of the groove; the transparent assembly is arranged on the surrounding surface and seals the opening of the groove; and the enclosed wall is arranged on the upper surface of the shell and surrounds the transparent assembly.

Description

technical field [0001] The present invention relates to a light emitting diode (light emitting diode, LED) packaging structure, in particular to a light emitting diode packaging structure that can integrate light path design. Background technique [0002] The use of projectors has been widely used in daily life. For example, in general conference briefing occasions, the projector can be used to display the content of the report so that all participants can watch the data at the same time; or when watching movies at home, you can also Using the projector to project images, users can have theater-like enjoyment in their own living room. In addition, with the advancement of technology, the main types of digital projectors on the market include: cathode ray tube (cathode ray tube, CRT) projectors, liquid crystal display (liquid crystal display, LCD) projectors, digital light processing (digital light processing, DLP) projectors, liquid crystal on silicon (LCOS) projectors and o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/16H01L33/00
CPCH01L2224/48091H01L2924/19107
Inventor 周和穆李晓乔谢忠全
Owner EVERLIGHT ELECTRONICS
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