Durable glass-ceramic housings/enclosures for electronic devices

Abstract

The invention relates glass ceramic articles suitable for use as electronic device housing or enclosures which comprise a glass-ceramic material. Particularly, a glass-ceramic article housing/enclosure comprising a glass-ceramic material exhibiting both radio and microwave frequency transparency, as defined by a loss tangent of less than 0.5 and at a frequency range of between 15 MHz to 3.0 GHz, a fracture toughness of greater than 1.5 MPam 1/2 , an equibiaxial flexural strength (ROR strength) of greater than 100 MPa, a Knoop hardness of at least 400 kg/mm2, a thermal conductivity of less than 4 W/m DEG C and a porosity of less than 0.1 %.

Description

[0001] Cross References to Related Applications [0002] Pursuant to 35 U.S.C. §119(e), this application claims priority to U.S. Provisional Application Serial No. 61 / 118049, filed November 26, 2008, which claimed the Priority to US Provisional Application Serial No. 61 / 077976, filed July 3, 2008. technical field [0003] This invention relates to glass ceramics useful as durable housings or enclosures for electronic equipment. In particular, the present invention relates to glass-ceramics having higher fracture toughness and hardness than glass, low thermal conductivity, and transparency to radio frequency and microwave frequencies, which are particularly suitable for use as durable housings or enclosures for electronic devices. cover. technical background [0004] Over the past decade, portable electronic devices, such as laptop computers, PDAs, media players, cellular phones, etc. (often referred to as "portable computing devices"), have become smaller, lighter, and mor...

AI Technical Summary

Problems solved by technology

Lightweight enclosures, typically formed with thin plastic structures and few joints, tend to be softer and more likely to wrinkle and bend than stronger and more rigid enclosures, which Hoods are typically made with thicker plastic structures and mor...

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