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Semiconductor element, packaging structure and forming method of semiconductor element

A semiconductor and component technology, applied in the field of bump structure technology, can solve the problem of high risk of short circuit and achieve the effect of avoiding short circuit or bridging

Active Publication Date: 2011-08-10
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the quality and reliability of lead-free solder bumps do not always meet the requirements
For smaller pitches and higher integration densities, there is a higher risk of short circuits with lead-free solder in process and flip-chip packages

Method used

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  • Semiconductor element, packaging structure and forming method of semiconductor element
  • Semiconductor element, packaging structure and forming method of semiconductor element
  • Semiconductor element, packaging structure and forming method of semiconductor element

Examples

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Embodiment Construction

[0014] The bumping process in semiconductor devices described below can be applied to flip-chip packaging, wafer-level chip-scale packaging (WLCSP), three-dimensional integrated circuit (3D-IC) stacking, and / or any advanced packaging technologies. Embodiments relate to solder bumps for semiconductor devices and methods of forming the same. In the following description, various specific examples will be preceded to facilitate those skilled in the art to have a comprehensive understanding of the present invention. However, those skilled in the art should understand that the actual operation does not need to fully comply with these special cases. In some instances, structures and processes well known in the art have not been described in detail to avoid unnecessarily obscuring the disclosure. In the following description, "an embodiment" refers to a particular feature, structure, or structure in which at least one embodiment is combined. Thus, references to "an embodiment" in d...

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Abstract

The invention provides a semiconductor element, a packaging structure and a forming method of a semiconductor element. A solder bump provided in the semiconductor element is disposed on a welding pad and is electrically connected to the welding pad. A metal cover layer is disposed at a part of the welding bump. The melting point of the metal cover layer is higher than that of the welding bump. The invention is advantageous in that the metal cover layer can be used as a hardstop element; the bump structure after packaging can maintain a consistent height; the problem of short circuit or bridgejoint can be reduced and even prevented.

Description

technical field [0001] The present invention relates to a semiconductor element, in particular to a process for a bump structure in a semiconductor element. Background technique [0002] Modern integrated circuits are composed of millions of active components such as transistors and / or passive components such as capacitors arranged horizontally. These components are isolated from each other in the initial process, but are interconnected to form functional circuits in subsequent processes. A typical interconnect structure includes horizontal interconnects such as metal lines, and vertical interconnects such as vias and contacts. The performance and density of modern integrated circuits depend on interconnects. On top of the interconnect structure, exposed pads are formed on each chip surface. Through the pads, the chip can be electrically connected to the package substrate or another die. The pads can be used for wire bonding or flip chip bonding. In a typical bumping pr...

Claims

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Application Information

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IPC IPC(8): H01L23/00H01L23/488H01L21/60
CPCH01L2924/13091H01L23/52H01L23/49811H01L24/11H01L21/44H01L21/76885H01L2924/1306H01L2924/1305H01L2224/10145H01L24/13H01L2224/10126H01L2924/01322H01L2224/13562H01L2924/14H01L2224/11825H01L2224/11823H01L2224/13565H01L24/03H01L2224/1147H01L2224/13018H01L2224/0347H01L2224/0361H01L2224/03912H01L2224/11849H01L2924/00H01L2924/00012H01L2224/11H01L24/05H01L2224/80815H01L2224/81815
Inventor 萧义理余振华郑心圃董志航魏程昶
Owner TAIWAN SEMICON MFG CO LTD
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