Lead frame of high-power chip package structure and manufacturing method thereof

Abstract

The invention discloses a lead frame of a high-power chip package structure and a manufacturing method thereof. A chip holder of the lead frame has a thickness of at least 0.5mm, so that sufficient heat absorbing efficiency and heat dissipation efficiency can be provided. The chip holder is also provided with an accommodating space for accommodating an adhesive layer, and a plurality of bumps are arranged at the inner bottom of the accommodating space, so that the lower surface of a high-power chip is prevented from tilting and an adhesive material in the accommodating space is prevented from overflowing, the levelness of the high-power chip is maintained, and the adhesion thickness of the adhesive layer is effectively and uniformly controlled. Therefore, the uniformity of heat energy conduction of the adhesive layer is favorably kept, furthermore, the reliability of the high-power chip package structure is relatively improved, and the service life is relatively prolonged.

Description

technical field [0001] The present invention relates to a lead frame of a high-power chip packaging structure and a manufacturing method thereof, in particular to a lead frame of a high-power chip packaging structure capable of uniformly controlling adhesive thickness and a manufacturing method thereof. Background technique [0002] Nowadays, in order to meet the needs of various high-density packaging, the semiconductor packaging industry has gradually developed various types of packaging structures, and these packaging structures usually use leadframes or packaging substrates as the chip-carrying structures. The carrier board (carrier), where the common packaging structure using a lead frame is, for example, a small outline package structure (small outline package, SOP), a quad flat package structure (quad flat package, QFP) or a quad flat no-lead package structure ( quad flat no-lead package, QFN) etc. Furthermore, when the semiconductor chip to be packaged is a high pow...

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Problems solved by technology

In this way, the adhesive layer 14 is prone to local deterioration due to uneven heating, and may cause delamination locally

Once peeling occurs, the high heat generated by the chip 13 will not be able to dissipate heat downward in time, and there is a very high risk of burning, thus relatively reducing the reliability and service life of the packaging structure 10

In addition, if there is no anti-tilting structure in the groove 111, when the adhesive material of the adhesive layer 14 is designed to reach a certain thickness, not only the amount of material used is relatively large, but also relatively soft, which is very easy to be squeezed out, and Glue overflow occurs, thereby polluting the bonding quality of the grounding area on the upper surface of the chip holder 11

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