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Led array module and fabrication method thereof

一种LED阵列、导电层的技术，应用在照明和加热设备、电气元件、电路等方向

Inactive Publication Date: 2014-04-09
EUCHENIX CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Also, in order to increase the effect of heat radiation, an attempt was made to form a circuit using only two metal plates, but there was a problem that only a parallel circuit could be formed

Method used

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  • Led array module and fabrication method thereof
  • Led array module and fabrication method thereof
  • Led array module and fabrication method thereof

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Experimental program
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Embodiment Construction

[0037] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0038] [First embodiment of method of manufacturing LED array module]

[0039] figure 1 is a flowchart explaining the method of manufacturing the LED array module according to the first embodiment of the present invention, and Figures 2 to 9 is shown based on figure 1 Cross-sectional view of the process of fabricating an LED array module.

[0040] In the method of manufacturing the LED array module according to the first embodiment of the present invention, the LED array module is manufactured using the upper conductive layer 100 and the lower conductive layer 200 having predetermined sizes. Basically, the method includes the following six steps.

[0041] In a first step ( S100 ), the upper conductive layer 100 is attached to the lower conductive layer 200 . In this case, the upper conductive layer 100 and the lower conductive laye...

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PUM

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Abstract

Disclosed herein are an LED array module that radiates high-temperature heat emitted from LEDs using a radiation block by attaching LEDs to the radiation block without using a printed circuit board (PCB), and a method of manufacturing the same. The method includes the steps of: attaching an upper conductive layer to a lower conductive layer by an insulative adhesion layer as an intermediate layer; forming an insulating layer on the entire exposed surface of the upper conductive layer and the lower conductive layer; forming a plurality of LED mounting regions by machining the upper conductive layer such that the upper surface of the lower conductive layer is exposed; mounting an LED in each of the LED mounting regions such that power is supplied to the LED by the lower conductive layer and the upper conductive layer; charging each of the LED mounting regions with a resin having insulation properties and transparency; and respectively forming upper separation grooves and lower separation grooves in the upper conductive layer and the lower conductive layer abreast in a width direction such that each of the upper conductive layer and the lower conductive layer is divided into a plurality of slices.

Description

technical field [0001] The present invention relates to an LED array module that uses a radiation block to radiate high-temperature heat emitted from LEDs without using a printed circuit board (PCB) by attaching LEDs to the radiation block, wherein the radiation block includes an upper The conductive layer and the lower conductive layer, and each conductive layer is divided into multiple slices to allow multiple LEDs to be combined in series and parallel to form a circuit, so as to meet various power requirements. Background technique [0002] Conventionally, LEDs (Light Emitting Diodes) have been limitedly used in backlight units of displays as light sources of LCD modules. In this case, LEDs can be used without serious problems because they have a low power consumption of about 0.1W. However, LEDs are gradually becoming widely used in lighting lamps, street lamps, security lamps, and fishing lamps because of their various characteristics and advantages. LED products for ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64
CPCH01L2924/0002H01L2933/0075F21K9/00H01L2933/0066H01L33/647H01L25/0753H01L2924/00
Inventor 金银镒柳宇泰
Owner EUCHENIX CO LTD
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