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Lead frame bending device

A lead frame and bending device technology, applied in the directions of feeding device, positioning device, storage device, etc., can solve the problems of bending angle consistency error, unable to meet production requirements, affecting product quality, etc., to achieve good consistency, The effect of high production efficiency and improved product quality

Inactive Publication Date: 2011-09-21
TONGLING HUIZHI ELECTROMECHANICAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method can meet the processing requirements, the efficiency is extremely low and cannot meet the production needs
At the same time, due to manual bending, there is a large error in the consistency of the bending angle, which may even cause the lead frame to be scrapped; and manual direct contact with the lead frame will also cause certain corrosion and damage to the surface, thus affecting product quality

Method used

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Examples

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Embodiment Construction

[0015] Such as Figure 1 to Figure 4 As shown, the feeding guide rail is composed of an upper guide rail 4 and a lower guide rail 3, the lower guide rail 3 is fixed on the frame 11 by screws 111, the frame 11 is fixed on the base 1, and the lower guide rail 3 is provided with a lead frame groove. When the guide rail 4 is fixed on the lower guide rail 3 by screws 31, the lead frame groove forms a horizontal slideway 31 that is open on the side wall of the guide rail and can pass through the pin portion 81 of the lead frame 8, and the lower guide rail 3 outside of the slideway 31 is provided with a support The movable guide rail 6 of the heat sink part 82 of the lead frame is provided with a chute 63 cooperating with the heat sink part 82 of the lead frame. The brackets 36, 32 of the feed port end are integrated with the lower guide rail 3, the feed port end bracket 32 ​​is fixed on the lower guide rail 3 by two pins 33, 34, and the two ends of the movable guide rail 6 are adjac...

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Abstract

The invention relates to a lead frame bending device which can bend a pin part and a radiating fin part on a lead frame into a certain angle. The lead frame bending device comprises a rack, a lead frame feeding guide rail arranged on the rack, a limit block which is arranged on the rack and is used for supporting a movable guide rail, a driving device used for driving the movable guide rail to turn upward and a feeding device composed of a feeding idler wheel, a pressing wheel and a corresponding driving device, wherein the side wall of the guide rail is provided with a horizontal slide rail which can be passed through by the pin part of the lead frame, the guide rail is provided with the movable guide rail used for supporting the radiating fin part of the lead frame at the outer side of the lower rail of the slide rail, and the two ends of the movable guide rail are hinged with the guide rail. By applying the lead frame bending device, the production efficiency is high, the consistency of processed workpieces is good, the error is small, the yield is high, and the manufacturing cost is greatly reduced.

Description

technical field [0001] The invention relates to a device used for the post-process processing of a semiconductor lead frame, in particular to a lead frame bending device for bending the lead part and the heat sink part on the lead frame into a certain angle. Background technique [0002] At present, the commonly used method is to bend the lead frame and the heat sink at a certain angle by manual bending before the lead frame is processed in the subsequent process. Although this method can meet the processing requirements, the efficiency is extremely low and cannot meet the production needs. At the same time, due to manual bending, there is a large error in the consistency of the bending angle, which may even cause the lead frame to be scrapped; and manual direct contact with the lead frame will also cause certain corrosion and damage to the surface, thus affecting product quality. Contents of the invention [0003] The object of the present invention is to provide a lead...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D7/00B21D43/09
Inventor 干松云谢骏柏加法刘祖词
Owner TONGLING HUIZHI ELECTROMECHANICAL
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