Resin complex and laminate
A resin composite and laminate technology, applied in coating, transportation and packaging, metal material coating process, etc., can solve the problems of difficult to have metallic luster on the resin surface, poor radio frequency characteristics, etc., and achieve good adhesion , the effect of excellent molding properties
Inactive Publication Date: 2011-09-28
FUJIFILM CORP
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AI Technical Summary
Problems solved by technology
[0004] On the other hand, the surface roughness makes it difficult for the resin surface to have a metallic luster
In addition, when applied to printed circuit boards, patterned metal films formed by plating on the surface of resin substrates also suffer from poor radio frequency characteristics due to the roughness of the interface with the substrate
[0005] Moreover, the roughening of the substrate surface requires treatment of the substrate surface with a strong acid such as chromic acid or permanganic acid, and also causes environmental problems such as disposal of liquid waste
Method used
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Embodiment 1
[0325] (Synthesis Example 1: Synthesis of Hydrophobic Compound A)
[0326] First, polymer A having a polymerizable group and an interacting group was synthesized as follows. Into a three-necked flask having a volume of 500 mL, 20 mL of ethylene glycol diacetate, 7.43 g of hydroxyethyl acrylate, and 32.0 g of cyanoethyl acrylate were added, and the mixture was heated to 80°C. To the mixture, a mixture containing 0.728 g of V-601 and 20 mL of ethylene glycol diacetate was added dropwise over 4 hours. After the dropwise addition, the mixture was reacted for 3 hours.
[0327]To the reaction solution, 0.30 g of di-t-butylhydroquinone, 1.04 g of U-600 (Nitto Kasei Co., Ltd.), 21.87 g of Karenz AOI (Showa Denko K.K.) and 22 g of ethylene glycol diacetate were added , and the mixture was reacted at 55° C. for 6 hours. Then, to the reaction solution, 4.1 g of methanol was added, and the reaction was performed for another 1.5 hours. After the reaction was finished, the solid was col...
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Abstract
Disclosed is a resin complex capable of being plated, which has high hydrophobicity, excellent molding properties and good adhesion to a plating layer. Also disclosed is a laminate containing a layer comprising the resin complex. Further disclosed is a method for producing the laminate. Specifically disclosed is a resin complex capable of being plated, which comprises a hydrophobic compound (A) and a hydrophobic resin (B), wherein the hydrophobic compound (A) has a functional group capable of interacting with a plating catalyst or a precursor thereof or a metal and the hydrophobic resin (B) is immiscible in the hydrophobic compound (A). The resin complex has a phase-separated structure in which the hydrophobic compound (A) forms a dispersing phase and the hydrophobic resin (B) forms a continuous phase. The hydrophobic compound (A) is exposed on at least a part of the surface of the resin complex.
Description
technical field [0001] The present invention relates to a resin complex capable of being plated, comprising a layer made of the resin complex capable of being plated, and a method for producing the laminate. Background technique [0002] Recently, a technique of forming a plated layer on the surface of a resin molded article has been used in various fields for functional or decorative purposes, and attempts have been made to improve the technique. For example, the technique of forming a plating layer on an insulating film is used in printed circuit boards for electronic devices and electromagnetic interference shielding films for plasma displays. Resin moldings such as automotive parts are plated with metals such as copper and nickel to add touch of class and aesthetic value thereto. [0003] Generally, in order to improve the adhesion between the resin surface and the plating layer, surface roughening treatment for roughening the resin surface is performed. Adhesion betwe...
Claims
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IPC IPC(8): C08L57/00C08F20/10C08L101/00C23C18/30C25D5/56
CPCC08L55/00H05K2203/122C08L33/18H05K3/387C08F293/005C08F220/42C25D5/56C23C18/30Y10T428/24355Y10T428/31855C08F220/281
Inventor 佐藤真隆鹤见光之
Owner FUJIFILM CORP