Method for detecting welding quality of semiconductor
A technology of quality testing and testing methods, applied in the direction of material resistance, etc., can solve the problems of time-consuming testing methods, inability to determine surface product characteristics, and products that cannot be tested
Active Publication Date: 2013-07-24
LESHAN RADIO
View PDF2 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] Using the above judgment methods, it is impossible to accurately judge whether the welding of the product is good, and the detection method is time-consuming, troublesome and difficult to operate
In addition, the product cannot be tested after packaging, because the plastic package has sealed the product, even if the cover is opened, the shape of the product will change, and the characteristics of the product on the surface cannot be determined
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0018] The above content of the invention of the present invention will be further described in detail below in conjunction with specific embodiments.
[0019] However, it should not be construed that the scope of the above-mentioned subject matter of the present invention is limited to the following examples. Without departing from the above-mentioned technical idea of the present invention, various replacements and changes made according to common technical knowledge and customary means in this field shall be included in the scope of the present invention.
[0020] See figure 1 As shown, the semiconductor welding quality detection circuit is composed of a current setting unit, a waveform monitoring unit, a timing unit, and a product to be tested (semiconductor). Among them, one end of the current setting unit and the waveform monitoring unit connected in parallel is connected to the product to be tested ( On the positive electrode of the semiconductor), the other end afte...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a method for detecting the welding quality of a semiconductor. The method comprises the following steps of: applying needed current to a product to be detected by using ac current supply unit; monitoring a positive V-A characteristic curve of the product to be detected in real time by using a waveform monitoring unit to find whether the curve varies in real time; and recording time from the application of current to a moment when the V-A characteristic of the product to be detected varies by using a timing unit, wherein the time is longer, the resistance value of the ohmic contact resistance of the product is smaller and the welding quality is more reliable. By adopting the method, the ohmic contact situation of a semiconductor product after welding can be monitored effectively, and the welding quality of the product can be compared, limit by the current state of the product to be detected is avoided, and testing can be finished by adopting the conventional simple long-persistence oscillograph and timer.
Description
technical field [0001] The invention belongs to semiconductors, in particular to a semiconductor welding quality detection method. Background technique [0002] The current semiconductor welding quality inspection has the following methods: [0003] 1. Mechanical method, inferring the welding position of the chip and the frame; [0004] 2. Whether the ohmic contact of the welding surface is good or not, compare the silicon and alloy area and area ratio of the inferred surface to judge whether the welding is good; [0005] Using the above judgment method, it is impossible to accurately judge whether the welding of the product is good, and this detection method is time-consuming, troublesome and difficult to operate. In addition, the product cannot be tested after packaging, because the plastic package has sealed the product, even if the cover is opened, the shape of the product will change, and the characteristics of the product on the surface cannot be determined. Conten...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G01N27/04
Inventor 潘敏智
Owner LESHAN RADIO