Master mask, exposure monitor method, exposure method and semiconductordevice mfg method
一种制造方法、半导体的技术,应用在半导体/固态器件制造、照相制版工艺曝光装置、微光刻曝光设备等方向,能够解决不能预测曝光量影响等问题
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[0092] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar reference numerals are given to those same or similar parts. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the planar size, the ratio of the thickness of each layer, and the like are also different from the actual relationship and ratio. Therefore, the specific thickness or size should be judged with reference to the following description. In addition, it is a matter of course that the relationship or the ratio of the mutual dimensions also includes a portion that differs between the drawings.
[0093] The original plate 4 for double exposure related to the embodiment of the present invention is as figure 1 As shown, by the first mask portion 14a having the first circuit pattern area 21 configured with the circuit pattern to be exposed in the f...
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Abstract
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