Parts Handling Carrier

Abstract

The invention provides a component moving carrier which can stably maintain a plurality of components like an electronic component in any processings. The component moving carrier (1) comprises a panel-shaped lower plate (20), a panel-shaped middle plate (30) which includes a plurality of first hole portions communicating in the thickness direction and are coupled on the lower plate (20) through overlapping, a panel-shaped upper plate (40) which includes a plurality of second hole portions communicating in the thickness direction at a position corresponding to the first hole portion and are coupled on the middle plate (30) through overlapping. The first and the second hole portions form an accommodating portion (10) for accommodating components. The middle plate (30) includes an elastic component (31) which applies force on components in the accommodating portion (10) for clamping the components in the accommodating portion (10).

Description

technical field [0001] The present invention relates to a component conveyance carrier for accommodating and conveying components such as electronic components. Background technique [0002] In recent years, electronic components such as piezoelectric vibrators have been gradually reduced in size, and chip-shaped electronic components that can be surface-mounted have gradually increased. Since such electronic components are very small, during the manufacturing process, electronic components are accommodated on a component carrier, and the component carrier is transported to collectively transport a plurality of electronic components between manufacturing processes. In addition, various processing and inspection are performed through the manufacturing process in a state where the electronic component is housed on the component carrier. [0003] However, the conventional component carrier is provided with a plurality of accommodating portions formed by recessing plates, and o...

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Problems solved by technology

[0006] However, the component carrier (carrier) described in the above-mentioned Patent Document 1 has a complicated structure with an elastic layer material that can slide and move between the base layer material and the positioning layer material, so there is an increase in manufacturing cost and sometimes it cannot be used. The problem of ensuring the reliability of the movement

[0007] Specifically, when constituting a component carrier capable of accommodating a large number of gradually miniaturized electronic components, it is necessary to form the positioning layer material and the elastic layer material thin and wide, but in this case, to maintain the positioning layer The flatness of the material and the elastic layer material and making it very difficult for the elastic layer material to slide in such a way that they don't bend or get caught etc.

[0008] In addition, because the height of the first elastic body of the elastic layer material clamping the electronic component is different from that of the opening end of the positioning layer material, a moment acts on the electronic component, so there is a problem that the electronic component cannot be stably clamped

In particular, in the process of heating the component carrier such as when soldering and sealing the electronic component package on the component carrier, there is a possibility that the positional relationship with the first elastic body may change because the positioning layer material may be deformed by heat. , and cannot hold electronic components, so the problem of not being able to use

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