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Pressure Sensor Chip

A pressure sensor and pressure technology, applied in the direction of measuring fluid pressure, instruments, measuring fluid pressure through electromagnetic components, etc., can solve problems such as adverse effects of cost

Inactive Publication Date: 2015-10-28
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These special measures have an adverse effect on the cost
In addition, these glass structures are potential weak points in the hermetic aspects of the sensor

Method used

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  • Pressure Sensor Chip

Examples

Experimental program
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Effect test

Embodiment Construction

[0014] From figure 1 It can be seen that the assembled pressure sensor produced according to the method proposed according to the invention comprises a cover part 12 and a housing part 14 . Preferably the cover part 12 and the housing part 14 are made of metallic material. However, plastic materials are also conceivable. The outer planar sides of the cover part 12 and the housing part 14 are preferably smooth and planar, so that, if necessary, they can be mounted directly on a pressure source, such as for example on a vehicle transmission or the like, and in particular smaller parts can be used. The sealing ring simplifies the mounting and on the other hand leads to a relatively low mechanical load on the pressure measuring chip and its mounting. Such as figure 1 As indicated by the dashed line, one of the housing parts, whether it is the cover part 12 or the housing part 14 , has a flange-shaped extension 62 . The extension 62—in figure 1 Indicated by the dotted line in ...

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PUM

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Abstract

The pressure sensor module (10) has a pressure measurement chip (18) that is housed in a housing, where the pressure measurement chip is impinged with a pressure over an opening (38). A flex foil (32) is electrically connected with the pressure measurement chip over electrical contacts (22) and is fixed at fixing positions (48,50) in the housing. An independent claim is also included for a method for manufacturing a pressure sensor module.

Description

technical field [0001] The invention relates to a pressure sensor module. Background technique [0002] DE 101 07 813 A1 relates to a pressure sensor module. The pressure sensor module includes a commercially available sensor unit connected to an adapter. The adapter has a small volume for transferring pressure. The sensor unit includes a pressure sensor chip, wherein the sensor unit is installed in the pressure sensor module. The pressure sensor chip is mounted on the glass support, for example by means of an anode contact. The sensor unit has, for example, a two-part sensor housing. The glass holder is attached to the sensor housing, for example by welding. The pressure sensor chip is electrically connected within the sensor housing via a connection wire to an electrical sensor connection element. These sensor connection elements pass through the sensor housing. The pressure sensor chip has, for example, a thin film. The film is loaded with medium on the underside....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L9/00G01L19/00
CPCG01L19/143G01L19/0084
Inventor H-J.赫德里希C.H-M.德林
Owner ROBERT BOSCH GMBH