Substrate bonding device and substrate bonding method
A technology for bonding devices and substrates, which is used in transportation and packaging, conveyor objects, electrical components, etc., can solve problems such as the misalignment of the upper substrate and the lower substrate, and achieve the effect of improving the bonding efficiency of substrates
Inactive Publication Date: 2016-03-23
LIGADP
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Problems solved by technology
Accordingly, the substrate separated from the bonding member while being pressed by the diaphragm may slide on the contact surface with the diaphragm, and thus the upper and lower substrates may be misaligned
Method used
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[0021] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following exemplary embodiments, a substrate bonding apparatus will be described. However, the exemplary embodiments of the present invention may be applied to etching devices, deposition devices, and other devices, as well as to substrate bonding devices for bonding and separating substrates.
[0022] Such as figure 1 and figure 2 As shown, a substrate bonding apparatus according to an exemplary embodiment of the present invention includes a cavity. The cavity includes an upper cavity 100 and a lower cavity 200 , and the upper substrate S1 and the lower substrate S2 are respectively fixed in the upper cavity 100 and the lower cavity 200 . The lower chamber 200 is fixed to a base (not shown), and the upper chamber 100 is raised and lowered by a chamber elevator 300 .
[0023] The upper cavity 100 is provided with an upper surfa...
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The present invention relates to a substrate binding apparatus and a substrate binding method, wherein the substrate binding apparatus comprises a cavity; an upper surface plate arranged inside the cavity and provided with a binding component used for binding an upper substrate and a diaphragm for expanding to separate the upper substrate and the binding component; a lower surface plate arranged inside the cavity, wherein the lower surface plate is opposite to the upper surface plate, the supporter of the lower surface plate is bond to the lower substrate of the upper substrate; an elevating driver for driving the lower surface plate to move up and down; and a controller for controlling the elevating driver to move for binding the upper and lower substrates, wherein when the diaphragm expands the elevating driver is controlled to enable the lower surface plate to move downwards with a gradually-changed speed. Therefore, when the substrate bond to a bind clamping disc is separated from the binding clamping disc, the separating speed of the upper substrate bond on the binding clamping disc is controlled to stably keep the binding position of the upper substrate, thereby increasing the binding efficiency of the substrate.
Description
technical field [0001] The present invention provides a substrate bonding apparatus and method, and more particularly, relates to a substrate bonding apparatus and method for bonding substrates using a bonding chuck. Background technique [0002] This application claims the benefit of Korean Patent Application No. 10-2010-0085999 filed on September 2, 2010 and Korean Patent Application No. 10-2011-0027968 filed on March 29, 2011 Priority, all of which are hereby incorporated by reference in their entirety. [0003] A substrate bonding device is a device for bonding two substrates to manufacture a flat display panel, which is used to manufacture various flat display panels such as liquid crystal displays (LCDs), plasma display panels (PDPs), organic Light Emitting Diodes (OLEDs), etc. [0004] In order to bond the substrates, the substrate bonding apparatus includes a substrate chuck for supporting the substrates. A variety of substrate chucks and electrostatic chucks are ...
Claims
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IPC IPC(8): H01L21/67H01L21/677
Inventor 黄载锡
Owner LIGADP