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Ultra high-remperature plastic package and method of manufacture

A plastic material, molding technology, applied in the direction of semiconductor devices, circuits, electrical components, etc., can solve problems such as hindering practical application

Active Publication Date: 2014-12-31
IQLP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, the relatively low melting points of conventional LCP and other plastics prevent their practical use in this type of packaging

Method used

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  • Ultra high-remperature plastic package and method of manufacture
  • Ultra high-remperature plastic package and method of manufacture
  • Ultra high-remperature plastic package and method of manufacture

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Embodiment Construction

[0025] The contents of US Provisional Patent Application 60 / 577,530, filed July 7, 2004, entitled "Ultra High-Temperature Plastic Package and Method of Manufacture," are incorporated herein by reference.

[0026] A polymer is a compound formed by repeating arrangements of many identical, relatively simple molecules, linking units to form long, regularly-typed, typically chains. Linking units in a polymer chain are often referred to as "monomer units". figure 1 is a schematic diagram of an exemplary polymer (polyvinyl chloride). "Monomers" are the actual molecules used as building blocks in the synthesis of polymers. figure 2 is a schematic diagram of the monomer (vinyl chloride) used in polyvinyl chloride. Several forms of polymerization are known including polyaddition, polycondensation and reactive polymerization.

[0027] Heat, free radicals, or other catalysts are often used to alter monomers during polymerization. During polymerization, the electrons and / or atoms of...

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Abstract

A package for microelectronic circuits includes a frame made of a high molecular weight plastic material, such as a liquid crystal polymer (LCP), attached to a flange, or leadframe. The plastic material is injection molded to the flange. Initial polymerization of the plastic material can occur in a liquid state and results in an intermediate material having an initial melting temperature. After the frame is injection molded, the frame is heated and undergoes further (secondary) polymerization, thereby lengthening polymer chains in the plastic material. These longer polymer chains have higher molecular weight, and the resulting final material has a higher melting temperature, than the intermediate material. The resulting ultra-high molecular weight polymer can withstand high temperatures, such as those encountered during soldering. Thus, after the further (secondary) polymerization, a die can be soldered to the flange, without damaging the plastic frame.

Description

[0001] Statement Regarding Federal Funding for Research or Development [0002] (Not applicable) technical field [0003] The present invention relates to circuit packages for integrated circuits and, more particularly, to such circuit packages comprising polymers with high melting temperatures. Background technique [0004] Various plastics, such as liquid crystal polymers (LCP), are used in a wide range of manufactured goods, including consumer products, medical devices, and packaging for electronic integrated circuits. In many cases, plastics are heated during one or more steps in the manufacture of a product, or later, such as while the product is in use. For example, many products are manufactured by injection molding, which involves heating plastic to soften it and injecting the softened plastic into a mold. The plastic acquires the shape of the mold and (ideally) retains that shape throughout subsequent manufacturing steps and throughout the life of the resulting p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G85/00
CPCC08G85/004C08G85/002H01L23/047H01L2224/73265H01L2224/32245H01L23/293H01L2224/48247H01L24/73H01L2924/14
Inventor M·齐莫尔曼
Owner IQLP