Alignment verification method for exposure machine

Abstract

The invention discloses an alignment verification method for an exposure machine. The method comprises the following steps of: (1) design of a lower film: forming a plurality of alignment circles which are externally separated from one another and have the same radius, wherein the centers of the alignment circles are arranged linearly at equal intervals; (2) design of an upper film: correspondingly forming a plurality of verification circles on the upper film by using a concentric circle method, wherein the radiuses of the verification circles sequentially increase; and (3) measurement: respectively arranging the upper film and the lower film on an upper table surface and a lower table surface of the exposure machine, when the upper film and the lower film are aligned, observing the coincidence degree of each verification circle and each alignment circle from small to large by taking a verification reference circle as a starting point, if each verification circle and the corresponding alignment circle are concentric, determining that an accuracy requirement is met, otherwise, observing all verification circles one by one by taking the verification reference circle as the starting point, wherein the difference of the radiuses of the verification circle and the alignment circle, which are internally tangent, is the alignment offset of the upper film and the lower film and the alignment offset of the exposure machine, so that the alignment accuracy of the exposure machine can be quantitatively measured.

Description

technical field [0001] The invention relates to an alignment verification method of an exposure machine. Background technique [0002] With the rapid development of electronic technology, electronic products are constantly developing in the direction of miniaturization and high reliability. Therefore, printed circuit boards used in electronic products are also developing in the direction of miniaturization and high density. Therefore, printed circuit boards The route on the board becomes finer, and the pads on the printed circuit board become denser. In this way, in the exposure process of the printed circuit board, the requirements for the alignment accuracy of the printed circuit board become more and more high. [0003] At present, the alignment verification of the exposure machine has to wait until the verification plate is etched, and then use the X-ray inspection machine to judge whether there is a misalignment through the concentricity of the original target. At the ...

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Problems solved by technology

[0003] At present, the alignment verification of the exposure machine has to wait until the verification plate is etched, and then use the X-ray inspection machine to judge whether there is a misalignment through the concentricity of the original target. At the same time, the current alignment verification method of the exposure machine is very rough. Only two conclusions can be drawn: "misalignment" or "no misalignment". Therefore, in the current alignment verification method of the exposure machine, the alignment accuracy cannot be measured, so it is impossible to know what the alignment accuracy is

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