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Method for preventing electrostatic breakdown, method for manufacturing array substrate, and display backplane

A technology of electrostatic breakdown and manufacturing method, which is applied in the direction of static indicators, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems affecting product yield, electrostatic breakdown, etc., achieve safe manufacturing and production, and solve electrostatic breakdown high hair effect

Active Publication Date: 2015-10-07
BEIJING BOE OPTOELECTRONCIS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the TFT structure connected to the gate line, common electrode line, and data line on the static ring can not play its role until the entire array substrate is prepared. Play the role of preventing electrostatic breakdown
However, in the entire manufacturing process of the array substrate, the chemical vapor deposition and dry etching processes are processes with high incidence of static electricity, which is prone to electrostatic breakdown and affects the yield of products

Method used

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  • Method for preventing electrostatic breakdown, method for manufacturing array substrate, and display backplane
  • Method for preventing electrostatic breakdown, method for manufacturing array substrate, and display backplane
  • Method for preventing electrostatic breakdown, method for manufacturing array substrate, and display backplane

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Embodiment 1

[0032] figure 1 The flow chart of the method for preventing electrostatic breakdown provided by Embodiment 1 of the present invention, such as figure 1 As shown, the method includes:

[0033] 101: When forming the conductive pattern of the substrate, connect the metal wire forming the conductive pattern to the closed conductive ring located in the peripheral area of ​​the substrate;

[0034] 102: When static electricity is generated on the metal wire, guide the static electricity to the closed conductive ring.

[0035] According to the characteristic that static electricity tends to be distributed on the outer edge of the conductor, the embodiment of the present invention proposes a method of connecting the metal wire forming the conductive pattern to the closed conductive ring located on the periphery of the substrate when forming the conductive pattern of the substrate. In the process of manufacturing the substrate, if static electricity is generated on the metal wire, the...

Embodiment 2

[0041] An embodiment of the present invention provides a method for manufacturing an array substrate, and the method may include the step of forming a conductive pattern and an insulating layer on the base substrate.

[0042] Wherein, the description of the conductive pattern and the insulating layer is as follows: data lines, gate lines, gate electrodes, source electrodes, drain electrodes and active layers of TFT switches, and pixel electrodes may be collectively referred to as conductive patterns. In order to keep the insulation of each conductive pattern, the conductive patterns arranged in the same layer can be arranged at intervals, or the conductive patterns arranged in different layers can be separated by the insulating layer, for example, the gate line and the gate electrode are covered with a gate insulating layer, and the TFT switch and data The wires are kept insulated; the TFT switch and the data wires are covered with a passivation layer and kept insulated from th...

Embodiment 3

[0075] An embodiment of the present invention provides a display backplane. The display backplane is a semi-finished product formed in the process of manufacturing an array substrate in the above-mentioned method embodiment. It can be seen from the above-mentioned method embodiment that the display backplane includes: a base substrate, a lining A conductive pattern and an insulating layer are formed on the base substrate, and the conductive pattern may include a gate line and a data line; wherein, a first closed conductive ring and / or a second closed conductive ring are formed in a peripheral area of ​​the base substrate. The first closed conductive ring is set on the same layer as the gate line, and the second closed conductive ring is set on the same layer as the data line; the gate line is electrically connected to the first closed conductive ring, and the data line is electrically connected to the second closed conductive ring.

[0076] An embodiment of the present inventio...

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Abstract

An embodiment of the disclosed technology provides a method for preventing electrostatic breakdown during the manufacturing process of the array substrate. The method comprises: when forming a conductive pattern of a substrate, connecting conductive lines for forming the conductive pattern with a closed conductive ring on a same layer as the conductive lines in a peripheral region of the substrate, and wherein when electrostatic charges are generated over the metal line, the electrostatic charges are led to the closed conductive ring.

Description

technical field [0001] The invention relates to liquid crystal display technology, in particular to a method for preventing electrostatic breakdown, a manufacturing method of an array substrate and a display backplane. Background technique [0002] A liquid crystal display is a commonly used flat panel display at present, and a thin film transistor liquid crystal display (ThinFilm Transistor Liquid Crystal Display, TFT-LCD for short) is a mainstream product in the liquid crystal display. [0003] Electrostatic breakdown is a very common damage mode in the electronics industry. It is a phenomenon caused by electrostatic discharge of a large amount of static electricity concentrated to a certain part of the device. Electrostatic breakdown will cause very serious damage to TFT-LCD devices, and it needs to be avoided as much as possible during the manufacturing process of TFT-LCD devices. At present, the method often used in the TFT-LCD industry to prevent electrostatic breakdo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/133G02F1/1362H01L21/77
CPCH01L27/0288H01L27/124Y10T29/49155Y10T29/49156
Inventor 周伟峰郭建明星
Owner BEIJING BOE OPTOELECTRONCIS TECH CO LTD