Electroplating structure for golden fingers of flexible circuit board

Abstract

The invention discloses an electroplating structure for the golden fingers of a flexible circuit board, which contains the pins of golden fingers and outer electroplating lines, wherein the pins of the golden fingers to be electroplated are arranged on a flexible circuit board, and the outer electroplating lines are connected with the pins of the golden fingers. The electroplating structure for the golden fingers of the flexible circuit board is characterized in that the pins of the golden fingers at least contain two pins with different widths. In each outer electroplating line connected with the pins with different widths, an area of which the width is not the same with the widths on other electroplating lines is arranged on at least one electroplating line. When the golden fingers are electroplated according to the structure disclosed by the invention, the thicknesses of the outer electroplating lines connected with an electroplating plate of a traction line are regulated by the electroplating plate of the traction line according to the thicknesses and the widths of the formed golden fingers, so that the current dispersing difference of each finger is reduced. After current is dispersed evenly, the trends of the directional reducing speeds of metal cations are consistent during electroplating, so that the roughness of an electroplating layer is consistent. The refractive effects of metal ions to light are approximately equivalent, so that the brightness of the surfaces of the golden fingers is uniform, and no color difference exists; and moreover, the thickness of the electroplating layer is uniform, a favorable appearance effect is presented, and the quality of the appearance of the circuit board is greatly enhanced.

Description

technical field [0001] The invention relates to a gold finger electroplating structure of a circuit board, in particular to a gold finger electroplating structure of a flexible circuit board, which belongs to the field of electronic technology. Background technique [0002] In the prior art, there are two types of gold plating on flexible circuit boards. One is gold plating on the surface of the board and gold plating on the cutting head. Commonly known as gold finger gold plating, it is plated with hard gold. This is an alloy coating containing CO, Ni, Fb, Sb and other metal elements. Its hardness and wear resistance are higher than that of pure gold coating. The general gold coating requires thicker . Gold electroplating can only be plated under the condition of external current, so it is necessary that each pad can be wired, and it can be plated only after the wire is allowed. The surface treatment method of this kind of wire electroplating is to apply an external curre...

AI Technical Summary

Problems solved by technology

When electroplating the gold fingers of the flexible circuit board, due to the different thickness and width of the gold fingers designed on the circuit board, defects such as uneven surface brightness, color difference, and uneven thickness of the coating are prone to appear after electroplating, which will affect the appearance quality of the circuit board

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