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Probe card

A probe card and substrate technology, applied in the field of probe cards, can solve problems such as difficulties and achieve the effect of stable contact

Inactive Publication Date: 2012-07-04
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Under such circumstances, as described above, when it is intended to connect the wiring 205 of the support plate 203 and the circuit board 201 outside the fluid chamber 204, it is necessary to use an extremely narrow intervals to form wiring 205, which is difficult in practice

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Embodiments of the present invention will be described below. figure 1 It is a vertical cross-sectional view showing an outline of the configuration of the probe device 1 including the probe card according to the present embodiment. figure 2 It is a transverse cross-sectional view showing the outline of the structure of the probe card according to this embodiment.

[0030] The probe device 1 is provided with, for example, a probe card 2 and a mounting table 3 on which a wafer W as an object to be inspected is mounted. The probe card 2 is arranged above the mounting table 3 .

[0031] For example, the entirety of the probe card 2 is formed in a substantially disk shape. The probe card 2 is provided with: a plurality of contacts 10 which are in contact with the electrode pads U of the wafer W during inspection; a contact support plate 11 which supports the contacts 10 on the lower surface; a plurality of test chips 12 , the plurality of test chips 12 are used to tran...

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PUM

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Abstract

A probe card is used for testing electrical characteristics of a body under test. The probe card comprises: a plurality of probes for contacting a body under test during testing; a plurality of tester chips for sending and receiving electric test signals to and from the body under test and testing electrical characteristics of the body under test; a conductive portion, on the lower surface of which the probes are disposed and which electrically connects the probes and the tester chips corresponding to the respective probes; and a pressing portion for, during the testing, pressing the conductive portion toward the side of the body under test and applying a pressing force between the probes and the body under test.

Description

technical field [0001] The present invention relates to a probe card for inspecting electrical characteristics of an object to be inspected. Background technique [0002] For example, electrical characteristics of electronic circuits such as ICs and LSIs formed on semiconductor wafers (hereinafter referred to as "wafers") are inspected using, for example, a probe device including a mounting table for holding a probe card and the wafer. The probe card is equipped with: a plurality of contacts that are usually in contact with the electrode pads of the electronic circuit on the wafer; a support plate that supports these contacts with the lower surface; Circuit boards for electrical signals, etc. Then, the electronic circuit on the wafer is inspected by sending an electric signal from the circuit board to each contact in a state where each contact is brought into contact with each electrode pad of the wafer. [0003] In order to properly perform inspection of the electrical ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66G01R1/073G01R31/28
CPCG01R31/2887G01R1/07342G01R1/073H01L22/00
Inventor 小松茂和片冈宪一
Owner TOKYO ELECTRON LTD