Printed circuit board grounding structure for use with communication apparatus
A printed circuit board, printed circuit technology, applied in the printed circuit grounding device, printed circuit, printed circuit and other directions, can solve the problems of consuming manpower and material resources, increasing the cost of communication equipment, etc.
Inactive Publication Date: 2015-04-29
ASKEY COMP
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- Description
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AI Technical Summary
Problems solved by technology
[0004] However, using this known technology, an additional metal guard must be provided as an electromagnetic protection wall, and this extra metal guard will inevitably increase the cost of the entire communication equipment, and if the electronic components in the metal guard are to be overhauled, It takes a lot of manpower and material resources to remove the metal guard first to facilitate the maintenance of the internal electronic components
Method used
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[0026] In order to fully understand the purpose, features and effects of the present invention, the present invention will be described in detail by means of the following specific embodiments and accompanying drawings, as follows:
[0027] refer to Figure 1a-1b , is a schematic diagram of the grounding structure of the printed circuit board of the communication device according to the first embodiment of the present invention. in, Figure 1a is a schematic top view, and Figure 1b yes Figure 1a The schematic cross-section of A-A' in Fig.
[0028] At Figure 1a Among them, the printed circuit board grounding structure 2 is applied to the printed circuit board 4 to contact the grounded chassis 6 to form a grounding loop with the ability to shield electromagnetic waves. Wherein, the printed circuit board ground structure 2 includes a copper conductive layer 8 and a plurality of solder joints 10 . Wherein, the copper conductive layer 8 is disposed around the periphery of the...
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A printed circuit board grounding structure for use with a communication apparatus is configured for use with a printed circuit board to contact a grounded casing and thereby form a grounded circuit capable of electromagnetic wave shielding. The printed circuit board ground structure includes a copper conductive layer and a plurality of solder contacts. The copper conductive layer is circumferentially disposed along the periphery of the printed circuit board. The solder contacts are disposed on the copper conductive layer and used for electrically contacting with the casing. The printed circuit board grounding structure prevents deterioration of electromagnetic wave shielding despite oxidation of the copper conductive layer. The circumferentially-disposed copper conductive layer blocks electromagnetic wave generated from inside the printed circuit board, prevents leakage of the electromagnetic wave, and ultimately prevents the electromagnetic wave from interfering with other electronic apparatuses.
Description
technical field [0001] The invention relates to a grounding structure of a printed circuit board of a communication device, in particular to provide a grounding structure for the printed circuit board in the communication device to shield electromagnetic waves. Background technique [0002] In the known technology, the wire pattern on the printed circuit board is laid out on the printed circuit board by means of a circuit layout. With the development of high-speed communication technology, the electronic components arranged on the printed circuit board will generate electromagnetic waves under the transmission / reception of high-speed data, which will cause electromagnetic wave interference among the electronic components. In order to eliminate the above-mentioned electromagnetic wave interference, a specially designed wire layout can be used to reduce the influence of electromagnetic waves, and to prevent the electronic components on the printed circuit board from being inte...
Claims
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IPC IPC(8): H05K9/00H05K1/02H05K1/11
CPCH05K1/0215H05K1/0216H05K3/4007H05K2201/10371H05K9/0039
Inventor 温翔圣谢青峰
Owner ASKEY COMP