Combined packaging structure available for working at profound hypothermia for detectors, and manufacturing method of combined packaging structure
A packaging structure, deep low temperature technology, applied in semiconductor devices, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problems of infrared detectors that cannot be disassembled, destructive, and disassembled
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[0015] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0016] 1. Production and preparation of various parts
[0017] a) The shell bottom 1 is made of an alloy metal with a low expansion coefficient, such as Kovar, and four counterbore holes 101 that are evenly distributed and symmetrical are processed on the upper surface. After processing, its thickness is 2.0mm-8.0mm, the diameter of the counterbore 101 is 2.0mm-2.5mm, and the depth is greater than 1.0mm, and the diameter of the enlarged hole is 3.2mm-5.0mm, and the depth is greater than 1.2mm. The roughness of the heat conducting surface 103 is better than 0.8 μm.
[0018] b) The heat conduction film 2 is made of soft metal with high thermal conductivity, such as copper foil, silver foil, indium foil, etc., and the thickness of the metal foil is 0.05 mm to 0.50 mm. The diameters of the four symmetrical through holes 201 uniformly distributed...
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