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Combined packaging structure available for working at profound hypothermia for detectors, and manufacturing method of combined packaging structure

A packaging structure, deep low temperature technology, applied in semiconductor devices, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problems of infrared detectors that cannot be disassembled, destructive, and disassembled

Active Publication Date: 2014-06-04
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Effectively solve the following problems: the first infrared detector cannot be disassembled after being sealed and packaged, or even if it can be disassembled, it is a destructive disassembly problem

Method used

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  • Combined packaging structure available for working at profound hypothermia for detectors, and manufacturing method of combined packaging structure
  • Combined packaging structure available for working at profound hypothermia for detectors, and manufacturing method of combined packaging structure
  • Combined packaging structure available for working at profound hypothermia for detectors, and manufacturing method of combined packaging structure

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Experimental program
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Embodiment Construction

[0015] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0016] 1. Production and preparation of various parts

[0017] a) The shell bottom 1 is made of an alloy metal with a low expansion coefficient, such as Kovar, and four counterbore holes 101 that are evenly distributed and symmetrical are processed on the upper surface. After processing, its thickness is 2.0mm-8.0mm, the diameter of the counterbore 101 is 2.0mm-2.5mm, and the depth is greater than 1.0mm, and the diameter of the enlarged hole is 3.2mm-5.0mm, and the depth is greater than 1.2mm. The roughness of the heat conducting surface 103 is better than 0.8 μm.

[0018] b) The heat conduction film 2 is made of soft metal with high thermal conductivity, such as copper foil, silver foil, indium foil, etc., and the thickness of the metal foil is 0.05 mm to 0.50 mm. The diameters of the four symmetrical through holes 201 uniformly distributed...

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Abstract

The invention discloses a combined packaging structure available for working at profound hypothermia for detectors, and a manufacturing method of the combined packaging structure. The combined packaging structure not only can be used at a room temperature, but also can realize sealed packaging of detectors at profound hypothermia. The packaging structure comprises a tube shell bottom, a thermal conductive film, a ceramic electrode plate, a sealing ring, a tube cap base, a tube cap and a connecting screw rod. All parts are connected with one another through the connecting screw rod, and the connection parts are sealed via soft metal or epoxy glue, so that combination and separation of the packaging structure can be realized very conveniently, and simultaneously the air-tight sealing of the packaging structure can be realized.

Description

technical field [0001] The invention discloses a packaging structure of a photoelectric detector, in particular to a packaging structure and a manufacturing method capable of maintaining sealing under deep low temperature working conditions. Background technique [0002] Some detectors need to work at deep and low temperatures, such as long-wave infrared detectors made of mercury cadmium telluride materials. This type of detector usually has a special purpose, the production cost is high, and it is difficult to carry out mass production. During the production and use process, it is sometimes necessary to replace the detector installed in the packaging structure. [0003] Another problem brought about by cryogenic work is the packaging structure of the detector, especially when there are many lead-out wires of the detector. At present, the common packaging structures include the metal structure of insulator sintered metal pins, ceramic structure, plastic package structure, m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/09H01L31/18
CPCY02P70/50
Inventor 刘大福杨力怡徐勤飞洪斯敏
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI