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Method for configuring heat sensor of microprocessor

A microprocessor and thermal sensor technology, applied to the architecture with a single central processing unit, electrical digital data processing, digital data processing components, etc. A large number of problems, etc., to achieve the effect of reducing the number of thermal sensors, improving clustering efficiency, and fast analysis speed

Inactive Publication Date: 2015-01-28
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Through the search of the existing technologies, it is found that although these methods can provide a hot spot monitoring solution, under the high precision requirements, the number of sensors used is still large, which is not conducive to saving design costs and manufacturing costs
Especially for some high-performance and highly integrated microprocessors, due to process requirements, it is impossible to implant a large number of sensors inside them

Method used

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  • Method for configuring heat sensor of microprocessor
  • Method for configuring heat sensor of microprocessor
  • Method for configuring heat sensor of microprocessor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Such as figure 1 Shown, a kind of microprocessor thermal sensor configuration method, this method comprises the following steps:

[0024] The first step is to adopt the Alpha EV6 microprocessor architecture, run multiple working conditions on the microprocessor, use the SimpleScalar software to simulate the SPEC2000 (system performance evaluation test) standard test program to simulate different working conditions, and calculate the module through the power consumption calculation unit power consumption, the temperature distribution calculation unit calculates the temperature distribution of the microprocessor under the power consumption;

[0025] The above-mentioned power consumption calculation unit is Wattch infrastructure software, and the temperature distribution calculation unit is Hotspot software.

[0026] In the second step, the temperature distribution diagrams obtained by simulation under different test programs are merged and eliminated through MATLAB to ob...

Embodiment 2

[0043] refer to figure 1 As shown, the specific steps of the method are the same as in Example 1, the difference is that the maximum monitoring error is set to 2%, 3% and 4% respectively, and the thermal monitoring obtained by the method of the present invention and the existing k-means clustering technology is adopted. The number of sensors used in the scheme is compared, and the results are shown in Table 1, which proves that the method of the present invention greatly reduces the number of sensors under the same precision requirements. Especially when the precision requirement is high, the efficiency improvement of the method of the present invention is very obvious. (The 2% accuracy requirement is already close to the error limit, so the improvement is not obvious.)

[0044] Table 1

[0045]

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Abstract

The invention relates to a method for configuring a heat sensor of a microprocessor, and the method comprises the steps of running a plurality of operating modes on the microprocessor, calculating the power consumption of the microprocessor under different operating modes by utilizing a power consumption calculating unit, and calculating the temperature distribution under the power consumption by utilizing a temperature distribution calculating unit; implementing data processing for the temperature distribution obtained under different operating modes, and acquiring a hot-spot distribution stacking chart of each module of the microprocessor; setting an upper limit value for the hot-spot monitoring error, performing the optimized double clustering considering singular points for data points in the hot-spot stacking chart according to the upper limit value, and obtaining a clustered result of the hot spot; and configuring one heat sensor for each clustering according to the clustered result, placing the heat sensor on a mass center of all hot spots contained by the clustering, namely, an average point of weight of the temperature value, and ensuring that the temperature of all hot spots are monitored within the set maximal error. Compared with the prior art, the method has advantages of high measurement precision and low cost.

Description

technical field [0001] The invention relates to a sensor configuration method, in particular to a microprocessor thermal sensor configuration method. Background technique [0002] In modern high-performance circuits, due to the rapid development of miniaturization and large-scale integration process technology, the power density of microprocessors is becoming higher and higher. These power losses are converted into heat to increase the temperature of the chip, resulting in a decrease in the reliability of the microprocessor, an increase in leakage power consumption, and an increase in cooling costs. In order to better understand the operation of the microprocessor, many microprocessor manufacturers use the readings of the thermal sensor implanted on the chip to evaluate the current operating temperature of the chip in thermal monitoring. For example, the Intel Pentium 4 processor is equipped with a thermal sensor, which will trigger an alarm when the temperature exceeds the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F15/78G06F1/20
CPCY02B60/1207Y02B60/1275Y02D10/00
Inventor 邱赓李鑫刘涛刘文江戎蒙恬
Owner SHANGHAI JIAOTONG UNIV