Preparation method of nano silicon dioxide/polyacrylate modified epoxy resin adhesive

A technology of nano-silica and polyacrylate, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of high temperature performance and unsatisfactory peel strength, and achieve obvious toughening effect and excellent bonding performance Excellent effect of improving shear strength

Inactive Publication Date: 2012-10-03
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of unsatisfactory high-temperature performance and peel strength in existing nano-silica modified epoxy resin adhesives, and to provide a preparation method for nano-silica / polyacrylate modified epoxy resin adhesives

Method used

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  • Preparation method of nano silicon dioxide/polyacrylate modified epoxy resin adhesive
  • Preparation method of nano silicon dioxide/polyacrylate modified epoxy resin adhesive

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specific Embodiment approach 1

[0017] Specific embodiment one: the preparation method of nano silica / polyacrylate modified epoxy resin adhesive of this embodiment, carry out according to the following steps: one, 3~30g silica sol is mixed with 20~80g solvent, at 1200~2400r Stir at a shear rate of 0.5-1.5 hours, then adjust the shear rate to 120-600r / min, raise the temperature to 65-85°C, and under nitrogen protection, dissolve the initiator-dissolved acrylate comonomer Add the coupling agent dropwise to the reaction system at a constant speed, and react for 3 to 6 hours to obtain polyacrylate-modified nano-silica composite particles;

[0018] 2. Mix the polyacrylate-modified nano-silica composite particles obtained in step 1 with 30-100g of epoxy resin, react at 90-120°C for 1-2h, then add hydroquinone, and then vacuum Remove the solvent, unreacted acrylate comonomer and coupling agent by degassing method to prepare nano-silica / polyacrylate modified epoxy resin;

[0019] 3. Take 100 parts by weight of nano...

specific Embodiment approach 2

[0028] Specific embodiment two: the difference between this embodiment and specific embodiment one is that step one mixes 15g of silica sol with 50g of solvent, stirs for 1h at a shear rate of 2000r / min, and then adjusts the shear rate to 400r / min, The temperature was raised to 80°C. Other steps and parameters are the same as those in Embodiment 1.

specific Embodiment approach 3

[0029] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the amount of initiator in step one is 0.1-1.5g, the amount of acrylate comonomer is 3-30g, and the amount of coupling agent is 1.5~15g. Other steps and parameters are the same as those in Embodiment 1 or Embodiment 2.

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Abstract

The invention relates to a preparation method of an epoxy resin adhesive, particularly a preparation method of a nano silicon dioxide / polyacrylate modified epoxy resin adhesive. The invention solves the problems of unsatisfactory high-temperature properties and peel strength in the existing nano silicon dioxide modified epoxy resin adhesive. The method comprises the following steps: 1. preparing polyacrylate-modified nano silicon dioxide compound particles; 2. preparing the nano silicon dioxide / polyacrylate modified epoxy resin; and 3. preparing the nano silicon dioxide / polyacrylate modified epoxy resin adhesive. The invention has the characteristics of smaller addition amount of modified nanoparticles, obvious toughening effect and high high-temperature strength; and the peel strength and the shear strength of the nano silicon dioxide / polyacrylate modified epoxy resin adhesive are obviously enhanced.

Description

technical field [0001] The invention relates to a preparation method of an epoxy resin adhesive. Background technique [0002] Inorganic nanoparticles have the characteristics of surface effect, volume effect and quantum effect. Applying them to epoxy resin modification can not only improve the bonding performance, but also improve the rigidity and modulus of epoxy resin. However, due to the poor compatibility between inorganic nanoparticles and epoxy resin, the dispersion of nanoparticles in epoxy resin is not good, and the particles are easy to agglomerate, thus affecting the modification effect. [0003] At present, silane coupling agents are mainly used to modify the surface of nanoparticles to overcome the above shortcomings. It is reported that the method of high-speed stirring is used to disperse nano-silica pretreated by silane coupling agent into epoxy resin. When the amount of nano-silica added is 2.91wt%, its tensile shear strength reaches the extreme value. Com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04
Inventor 周继鑫刘晓辉韩春春赵颖朱金华李欣王刚张大勇
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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