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A method and device for inter-board communication of distributed equipment

A technology of distributed equipment and communication method, which is applied in the field of inter-board communication of distributed equipment, can solve problems such as waste of application layer processing resources, low interaction efficiency, complicated process, etc., to solve difficult maintenance, simplify the process of information interaction, and improve efficiency effect

Active Publication Date: 2015-12-09
RAISECOM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The embodiment of the present invention proposes a method and device for inter-board communication of distributed equipment, which is used to solve the complex process of information interaction between application layer management boards in the prior art, and the interaction efficiency is low, and the application layer will be wasted Dealing with resource issues

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  • A method and device for inter-board communication of distributed equipment
  • A method and device for inter-board communication of distributed equipment
  • A method and device for inter-board communication of distributed equipment

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Embodiment Construction

[0030] The embodiment of the present invention designs a RPC (Remote Procedure Call Protocol, Remote Procedure Call Protocol) private protocol, which is used for information exchange between boards, by encapsulating the communication protocol types required by the controlled boards of different hardware types in the initial In the driver header outside the RPC message, the purpose of the application layer calling the board through a unified interface protocol is achieved, so that the application layer does not need to perform information interaction management operations between boards according to the type of the managed board and communication type, simplifying The process of information interaction between the application layer management boards is simplified, and the processing resources of the application layer are avoided.

[0031] The embodiment of the present invention designs a method for inter-board communication of distributed equipment, which provides an optional in...

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Abstract

The invention relates to the field of digital communications, in particular to a method and a device for communication of boards in a distributed device. A communication process in a main control board includes that a communication function layer receives an interface call instruction issued by an upper-layer application through a communication interface layer, then a corresponding initial remote procedure call (RPC) private protocol request message is initially packaged according to a control parameter carried by the interface call instruction, the initially packaged initial RPC request message is sent to a communication adapter layer, the communication adapter layer further packages the received initial RPC request message according to a hardware type of a destination node address, the obtained RPC request message is sent to a communication driver layer, the communication driver layer sends the received RPC request message to a corresponding controlled board card, and the controlled board card is enabled to perform a corresponding operation according to the received RPC request message. According to the embodiment of the invention, the waste of processing resource of an application layer can be avoided.

Description

technical field [0001] The invention relates to the technical field of data communication, in particular to a method and device for inter-board communication of distributed equipment. Background technique [0002] Currently, the distributed devices on the market are mainly frame-type devices, which are generally composed of main control boards (referred to as main control boards) and service boards. Usually, there are many service boards in a chassis-type device, and the types and communication types of the included service boards are also inconsistent. [0003] The main control board in a chassis-type device is responsible for the configuration and management of the entire device and each service board, so there is a large amount of inter-board information interaction between the main control board and the service boards. [0004] At present, the process of information interaction between boards is controlled by the application layer. In the existing technology, since the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04L12/70
Inventor 王夕军宋显建肖迎杰
Owner RAISECOM TECH
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