Board edge graphical tool manufacturing method preventing electrostatic spraying board from falling off

A technology of electrostatic spraying and production methods, which is applied in the fields of printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problem that the clip cannot be clamped and fixed tightly, and achieve the effect of avoiding board falling and improving efficiency

Inactive Publication Date: 2015-02-25
SHENZHEN SUNTAK MULTILAYER PCB +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the object of the present invention is to provide a kind of board edge graphic tool manufacturing method that prevents electrostatic spraying from falling off the board, and is mainly used to solve the current electrostatic spraying process, because the clips cannot be clamped and fixed tightly due to the smooth edge of the circuit board, and the occurrence of The board drop problem, while ensuring the efficiency of electrostatic spraying

Method used

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  • Board edge graphical tool manufacturing method preventing electrostatic spraying board from falling off
  • Board edge graphical tool manufacturing method preventing electrostatic spraying board from falling off

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Embodiment Construction

[0019] In order to illustrate the idea and purpose of the present invention, the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0020] The invention provides a method for making a board edge graphic tool to prevent electrostatic spraying from falling off the board, which mainly includes the following steps:

[0021] A. Cutting the copper clad laminate, forming a multi-layer circuit board after making inner graphics and pressing, drilling and electroplating, or forming a single-sided circuit board after drilling and electroplating;

[0022] The multi-layer circuit board needs to cut the copper clad laminate first, and then form the inner layer graphics and press, drill, and electroplate; the single-sided circuit board needs to cut the copper clad laminate, and then go through drilling and electroplating. After forming, whether it is a multi-layer board or a single-layer board, the copper-clad laminate ...

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Abstract

The invention discloses a board edge graphical tool manufacturing method preventing an electrostatic spraying board from falling off. The method comprises the following steps of A, cutting a copper-clad board, forming a multilayer circuit board through manufacturing an internal graph, laminating, drilling and electroplating the copper-clad board, or forming a single-double-sided circuit board through drilling and electroplating the copper-clad board; B, manufacturing an external board graph of the multilayer circuit board or a Film picture which transfers the graph of the single-double-sided circuit board, wherein a circuit graph located at a middle part and a board edge stripe graph located at an external border are on the Film picture; C, pasting a dry film on the external board of the multilayer circuit board or on the upper and lower sides of the single-double-sided circuit board, para-pasting the Film picture on the dry film, performing exposure and development, transferring the circuit graph to the middle region of a circuit board substrate, and transferring the board edge stripe graph to the board edge external border of the circuit board substrate; and D, etching the circuit board substrate to manufacture the circuit board with board edge stripes on the external border. Compared with the prior art, the board edge graphical tool manufacturing method disclosed by the invention prevents the phenomenon of board falling, and simultaneously, the efficiency of electrostatic spraying is improved.

Description

Technical field: [0001] The invention belongs to the technical field of printed circuit board production, and specifically relates to a method for producing a board edge graphic tool to prevent electrostatic spraying from falling off the board. It is mainly used to solve the problem of ensuring the efficiency of electrostatic spraying of circuit boards in the current electrostatic spraying process Avoid the problem of board falling due to the fact that the edge of the circuit board is too smooth, resulting in the clip not being able to clamp and fix it tightly. Background technique: [0002] Printed circuit board is the most important basic electronic component in the electronics industry, and it has a wide range of applications in computer, communication, consumer electronics, industry, medical and military fields. With the development of science and technology and the continuous improvement of circuit board quality requirements, inkjet technology has gradually emerged in t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/28
Inventor 朱拓荣孝强韦昊敖四超
Owner SHENZHEN SUNTAK MULTILAYER PCB
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