Large-size low temperature cofired ceramic (LTCC) substrate sintering process

A large-size, substrate technology, applied in the field of large-size LTCC substrate sintering process, can solve problems such as cracks, deformation, warpage, etc., to achieve uniform heating, stable sintering curve, and a wide range of applications.

Active Publication Date: 2015-02-25
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the process problems such as warpage, deformation and cracks that occur in the sintering process of super-large-sized LTCC substrates, and ensure the flatness of super-large-sized LTCC substrates after sintering

Method used

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  • Large-size low temperature cofired ceramic (LTCC) substrate sintering process
  • Large-size low temperature cofired ceramic (LTCC) substrate sintering process

Examples

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0022] combine figure 1 and figure 2 , by setting multiple initial heating periods and debinding periods, and adjusting the time, speed and power parameters of each temperature range in the sintering curve, a suitable sintering curve can be obtained to ensure that the debinding of the large-size LTCC substrate is sufficient during the sintering process, and the substrate after sintering Good flatness.

[0023] The aluminum oxide sintered support with a size of 250mm×250mm×5mm is used in the sintering process of the large-sized LTCC substrate to support the large-sized LTCC substrate. The aluminum oxide sintered support is a plate with an area larger than the large-sized LTCC substrate. There...

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Abstract

The invention belongs to the preparation technical field of the low temperature cofired ceramic (LTCC) substrate. By reasonably adjusting the heating times heating speeds of the initial heating period, tape-ranked period, heating period in the sintering curve, the one-section arrangement in the initial heating period and the tape-ranked period is changed to the multi-section arrangement and a proper sintering curve is obtained; and when the sintering process is applied to the sintering of the large-size LTCC substrate, the phenomena of the large-size LTCC substrate after sintered, such as deformation, warping and cracking disappear completely. The sintering yield of the large-size LTCC substrate can be greatly increased and the sintering process plays an important role in the applications of LTCC materials.

Description

technical field [0001] The invention belongs to low-temperature co-fired ceramics (LTCC) process technology, and relates to a large-size LTCC substrate sintering process, which can meet the sintering of medium and large-scale substrates produced by the LTCC process. Background technique [0002] As electronic products have higher and higher requirements for performance, function, cost, reliability, and miniaturization, etc., the LTCC technology has been greatly improved, and the application of low temperature co-fired ceramic technology is becoming more and more extensive. With the application of 8″LTCC , The size of the substrate is also diversified, and some special super-sized substrates (substrate size 150mm×150mm) put forward higher requirements for the sintering process. [0003] Sintering is mainly to set a suitable sintering curve in the sintering furnace, control the heating by the gas heater, and control the temperature in the sintering furnace through the feedback...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/64
Inventor 濮嵩贺彪展丙章杨述洪车勤
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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