Improved floor heating modular structure

A modular structure, floor heating technology, applied in building structure, household heating, space heating and ventilation details, etc., can solve the problems of waste of electric resources, inability to store thermal energy, maintain temperature, etc., to promote blood circulation, The effect of speeding up the cooling cycle

Inactive Publication Date: 2013-01-16
张标
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Problems solved by technology

[0002] With the improvement of people's living standards, floor heating is more and more widely used. However, in the existing floor heating structure, the floor material layer and the heat pipe layer are usually used as the main basis, and they are stacked for use. This kind of floor hea

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  • Improved floor heating modular structure

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Embodiment Construction

[0015] Such as figure 1 As shown, an improved floor heating module structure of the present invention includes a heating pipe layer 1, the lower end of the heating pipe layer 1 is provided with an insulating layer 2, the upper end of the heating pipe layer 1 is provided with a heat storage layer 3, and the upper end of the heat storage layer 3 A metal layer 4 is provided, the upper end of the metal layer 4 is provided with a far-infrared ceramic layer 5, the upper end of the far-infrared ceramic layer 5 is provided with a heat dissipation layer 6, the heat dissipation layer 6 is provided with a heat dissipation hole 7, and the upper end of the heat dissipation layer 6 is provided with a floor material layer 8 , the floor material layer 8 is provided with bumps 9, the upper and lower ends of the floor material layer 8 and the insulation layer 2 are provided with protective films 10, the floor material layer 8 is made of concrete, the heating pipe layer 1 is wave-shaped, and the ...

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Abstract

The invention discloses an improved floor heating modular structure. The improved floor heating modular structure comprises a heating pipe layer and is characterized in that a thermal insulation layer is arranged at the lower end of the heating pipe layer; a heat storage layer is arranged at the upper end of the heating pipe layer; a metal layer is arranged at the upper end of the heat storage layer; a far infrared ceramic layer is arranged at the upper end of the metal layer; a heat radiating layer is arranged at the upper end of the far infrared ceramic layer; radiating holes are formed in the heat radiating layer; a floor material layer is arranged at the upper end of the heat radiating layer; salient points are arranged on the floor material layer; and a protection film is respectively arranged at each of the upper ends and the lower ends of the floor material layer and the thermal insulation layer. The improved floor heating modular structure has the advantages that the heat storage layer stores heat energy and can radiate heat after a power supply is cut off; the metal layer and the heat radiating layer can accelerate the circulation of radiating between the heating pipe layer and the floor material layer; and magnets in the salient points on the floor material layer can massage acupuncture points at foot soles so as to promote the blood circulation of a human body.

Description

technical field [0001] The invention relates to floor heating, in particular to an improved floor heating module structure. Background technique [0002] With the improvement of people's living standards, floor heating is more and more widely used. However, in the existing floor heating structure, the floor material layer and the heat pipe layer are usually used as the main basis, and they are stacked for use. This kind of floor heating cannot store part of the thermal energy. After the power is turned off, it cannot maintain the temperature continuously, resulting in a waste of electricity resources. Moreover, the general floor heating is flat, and people cannot bring health care to the human body when walking on it. . [0003] Therefore, there is an urgent need for an improved technology to solve this problem in the prior art. Contents of the invention [0004] The object of the present invention is to provide an improved floor heating module structure. [0005] The t...

Claims

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Application Information

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IPC IPC(8): F24D13/00F24D19/00E04F15/02E04F15/18
Inventor 张标
Owner 张标
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