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Method of forming encapsulated solid electrochemical element

A technology of electrochemical components and chemical components, applied in the direction of electrical components, electrochemical generators, circuits, etc., can solve the problems of keeping components together, mechanical heat transfer methods combined with time-consuming processes, etc.

Inactive Publication Date: 2015-11-25
EAGLE PICHER TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One problem with this process is that it is difficult to keep the elements together during bonding of the spacer material
In addition, the bonding process of the mechanical heat transfer method takes a lot of time

Method used

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  • Method of forming encapsulated solid electrochemical element
  • Method of forming encapsulated solid electrochemical element
  • Method of forming encapsulated solid electrochemical element

Examples

Experimental program
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Embodiment Construction

[0043] Hereinafter, the following exemplary embodiments will be described with reference to the structure of a storage battery (especially a lithium ion storage battery). The following exemplary embodiments can also be used for fuel cell assemblies and various other solid electrochemical elements. All the exemplary embodiments of the present invention are intended to be applicable to any field that is attempted to be applied.

[0044] figure 1 A vacuum table 100 is shown, which includes the vacuum plate 1 of the exemplary embodiment used in the method of packaging a solid electrochemical element 4 (ie, an electrode) according to various aspects of the present invention. The vacuum plate 1 is provided to restrict the movement of the electrochemical element assembly 6. The first separator 3, the second separator 5 and the solid electrochemical element 4 together form an electrochemical element assembly 6. The vacuum panel 1 may be used during at least some stages (preferably all ...

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Abstract

A method of forming an encapsulated solid electrochemical component includes stacking a first separator (3), a solid electrochemical component (4), and a second separator (5) on an upper surface of a vacuum plate to form an electrochemical component assembly, applying a vacuum to the electrochemical component assembly, and applying a first laser beam around at least part of a circumference (21) of the solid electrochemical component (4) in the electrochemical component assembly while applying the vacuum to melt and bond the first and second separators (3,5) together. The method also includes applying a second laser beam around the circumference (21) of the solid electrochemical component (4) in the electrochemical component assembly while applying the vacuum. The second laser beam has a second relatively high power compared to the power of the first laser beam such that the first and second separators (3,5) around the circumference (21) of the solid electrochemical component (4) are cut.

Description

Technical field [0001] The present invention relates to an improved method of packaging electrochemical components (especially electrodes, such as anodes and cathodes). In particular, the present invention relates to a method that can be used to hold the elements contained in the structure of the encapsulated electrode fixed when the separator material surrounding the periphery of the electrode is melted and cut by a laser to encapsulate the electrode. Then, the encapsulated electrodes (ie, the encapsulated anode and the encapsulated cathode) can be used to construct, for example, batteries, particularly lithium-ion batteries. However, as described below, the present invention is not limited to the encapsulation of electrodes, but can be applied to various solid electrochemical elements that may need to be encapsulated with porous materials. Background technique [0002] Lithium-ion battery cells use porous separator materials to separate the positive and negative electrodes (an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01M10/0525H01M10/0585H01M10/38B23K26/00B23K26/21B23K26/38
CPCH01M10/0525H01M10/0585H01M10/38Y02E60/122Y02P70/54Y10T29/49108Y02E60/10Y02P70/50
Inventor C·霍尔马克
Owner EAGLE PICHER TECH LLC