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Method of forming encapsulated solid electrochemical component

A technology for electrochemical components and chemical components, which is applied to electrical components, electrochemical generators, circuits, etc., and can solve the problems of mechanical heat transfer method combined with process time, components keeping together, etc.

Inactive Publication Date: 2013-01-16
EAGLE PICHER TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One problem with this process is that it is difficult to keep the elements together during bonding of the spacer material
In addition, the bonding process of the mechanical heat transfer method takes a lot of time

Method used

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  • Method of forming encapsulated solid electrochemical component
  • Method of forming encapsulated solid electrochemical component
  • Method of forming encapsulated solid electrochemical component

Examples

Experimental program
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Embodiment Construction

[0043] The following exemplary embodiments are described below with reference to the construction of a battery, in particular a lithium-ion battery. The following exemplary embodiments can also be used for fuel cell assemblies and various other solid electrochemical components. All exemplary embodiments of the present invention are intended to be applicable in any intended field of application.

[0044] figure 1 Shown is a vacuum table 100 comprising an exemplary embodiment of a vacuum panel 1 for use in a method of encapsulating solid electrochemical components 4 (ie, electrodes) according to various aspects of the present invention. A vacuum plate 1 is provided to limit the movement of the electrochemical element assembly 6 . The first separator 3 , the second separator 5 and the solid electrochemical element 4 together form an electrochemical element assembly 6 . The vacuum panel 1 may be used during at least some stages, preferably all stages, of the method of encapsula...

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Abstract

A method of forming an encapsulated solid electrochemical component includes stacking a first separator (3), a solid electrochemical component (4), and a second separator (5) on an upper surface of a vacuum plate to form an electrochemical component assembly, applying a vacuum to the electrochemical component assembly, and applying a first laser beam around at least part of a circumference (21) of the solid electrochemical component (4) in the electrochemical component assembly while applying the vacuum to melt and bond the first and second separators (3,5) together. The method also includes applying a second laser beam around the circumference (21) of the solid electrochemical component (4) in the electrochemical component assembly while applying the vacuum. The second laser beam has a second relatively high power compared to the power of the first laser beam such that the first and second separators (3,5) around the circumference (21) of the solid electrochemical component (4) are cut.

Description

technical field [0001] The present invention relates to an improved method of encapsulating electrochemical components, particularly electrodes, such as anodes and cathodes. In particular, the present invention relates to a method that can be used to hold in place components included in the construction of an encapsulated electrode when laser melting and cutting spacer material around the periphery of the electrode is used to encapsulate the electrode. The encapsulated electrodes (ie the encapsulated anode and the encapsulated cathode) can then be used to construct, for example, batteries, in particular lithium-ion batteries. However, as described below, the present invention is not limited to the encapsulation of electrodes, but is applicable to various solid electrochemical components that may require encapsulation with porous materials. Background technique [0002] Lithium-ion battery cells utilize porous separator materials to separate the positive and negative electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01M10/04H01M10/058B23K26/20B23K26/04B23K26/00B23K26/21B23K26/38
CPCH01M10/38Y02E60/122H01M10/0525H01M10/0585Y10T29/49108Y02E60/10Y02P70/50
Inventor C·霍尔马克
Owner EAGLE PICHER TECH LLC