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Infrared sensor

An infrared sensor and infrared technology, applied in the direction of instruments, scientific instruments, electric solid devices, etc., to achieve the effect of suppressing unevenness

Active Publication Date: 2014-12-10
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the other hand, the heat transferred to the infrared sensor chip through heat conduction or heat radiation from the medium (for example, nitrogen, etc.) inside the package of the IC chip mainly raises the temperature of the warm junction, so that a positive offset voltage is generated. main reason

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0043] Below, refer to Figure 1 to Figure 14 The infrared sensor of this embodiment will be described.

[0044] The infrared sensor of the present embodiment includes an infrared sensor chip 100 , an IC chip 102 for signal processing an output signal of the infrared sensor chip 100 , and a package 103 for accommodating the infrared sensor chip 100 and the IC chip 102 . In addition, in the infrared sensor, a thermistor 101 for measuring absolute temperature is housed in the package 103 .

[0045] Such as figure 1 As shown in E, the infrared sensor chip 100 has a thermal infrared detection unit 3 having a thermopile 30a formed on one surface side (front side) of a semiconductor substrate 1 made of a silicon substrate.

[0046] The package 103 has: a package body 104, which is equipped with an infrared sensor chip 100, an IC chip 102 and a thermistor 101; a package cover 105, which surrounds the infrared sensor chip 100 and the IC chip 102 between the package body 104 and the...

Embodiment approach 2

[0130] The basic structure of the infrared sensor of this embodiment is roughly the same as Embodiment 1, as Figure 19 As shown, the shape and the like of the cover member 106 are different. In addition, the same code|symbol is attached|subjected to the same component as Embodiment 1, and description is abbreviate|omitted suitably.

[0131] According to the infrared sensor of this embodiment, in the package body 104 , the second region 142 on which the IC chip 102 is mounted is set back from the surface of the first region 141 on which the infrared sensor chip 100 is mounted. Thus, a step is formed between the surface of the first region 141 and the second region 142 . Here, in the package body 104 , the size of the step is set so that the surface of the second region 142 recedes so that the size of the step is smaller than the thickness of the IC chip 102 .

[0132] The cover member 106 includes a front plate portion 107 with a window 108 formed in front of the infrared se...

Embodiment approach 3

[0137] The basic structure of the infrared sensor of this embodiment is roughly the same as Embodiment 2, as Figure 20 As shown, the shape and the like of the cover member 106 are different. In addition, the same code|symbol is attached|subjected to the same component as Embodiment 2, and description is abbreviate|omitted suitably.

[0138] The infrared sensor of this embodiment is not provided with the protruding piece 107b described in Embodiment 2 (refer to Figure 19 ),Such as Figure 20 As shown, the difference is that the distance between the front plate portion 107 and the infrared sensor chip 100 is set shorter than that of the infrared sensor according to the second embodiment.

[0139] Therefore, in the infrared sensor of the present embodiment, it is possible to suppress the unevenness of the S / N ratio in the plane of the infrared sensor chip 100 caused by the heat generation of the IC chip 102, and to realize the difference between the front plate portion 107 an...

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Abstract

Provided is an infrared sensor capable of suppressing variation in an S / N ratio in a plane of an infrared sensor chip resulting from heating of an IC chip. The infrared sensor includes: an infrared sensor chip (100) in which a plurality of pixel portions (2) each including a temperature-sensitive portion (30) formed of a thermopile (30a) is disposed in an array on one surface side of a semiconductor substrate (1); and an IC chip (102) that processes an output signal of the infrared sensor chip (100). A package (103) includes a package main body (104) on which the infrared sensor chip (100) and the IC chip (102) are mounted to be arranged side-by-side, and a package cover (105) that has a lens (153) transmitting infrared rays and is hermetically bonded to the package main body (104). The package (103) is provided therein with a cover member (106) that includes a window hole (108) through which infrared rays pass into the infrared sensor chip (100) and equalizes amounts of temperature change of hot junctions T1 and cold junctions T2 among the pixel portions (2), the temperature change resulting from heating of the IC chip (102).

Description

technical field [0001] The present invention relates to infrared sensors. Background technique [0002] Conventionally, an infrared sensor (infrared sensor module) has been proposed that includes an infrared sensor chip on one surface side of a silicon substrate in which a plurality of temperature sensing parts including a thermopile are arranged in an array. A pixel unit; an IC chip for signal processing an output signal of the infrared sensor chip; and a package for accommodating the infrared sensor chip and the IC chip (for example, refer to Japanese Patent Laying-Open No. 2010-78451). [0003] The package above is composed of a package body and a package cover. The package body is formed by arranging and installing the infrared sensor chip and the IC chip laterally. The package cover surrounds the infrared sensor chip between the package body and the package body. And the IC chip is covered on the main body of the package. Here, the package cover includes a lens for co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01J1/02H01L35/30
CPCH01L2924/0002G01J5/08G01J5/0806G01J5/06G01J5/12G01J5/0831G01J5/045G01J5/04H01L31/024H01L2924/00G01J5/16G01J5/20H01L23/34
Inventor 桐原昌男山中浩佐名川佳治明田孝典中村雄志植田充彦
Owner PANASONIC CORP
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