Electronic device

Abstract

The invention provides an electronic device which comprises a heating element and an outer shell; a heat radiating device is arranged between the heating element and the outer shell; the electronic device comprises a first layer and a second layer, wherein the first layer is in contact with the heating element; and the second layer is arranged on the first layer and is in contact with the outer shell; the heat conducting capability of the first layer is higher than that of the second layer; the second layer is used for preventing heat from passing through rapidly, so that heat is diffused at the first layer; or the electronic device comprises a first layer, a third layer and a second layer, wherein the first layer is in contact with the heating element; the third layer is in contact with the outer shell; the second layer is arranged between the first layer and the third layer; the heat conducting capabilities of the first layer and the third layer are both higher than that of the second layer; the second layer is used for preventing heat from passing through rapidly, so that heat is diffused at the first layer; additionally, the outer shell of the electronic device also can act as a heat radiating device, and comprises an inner layer in contact with the heating element and an outer layer which clings to the inner layer; the heat conducting capability of the inner layer is higher than that of the outer layer; and the outer layer prevents heat from passing through rapidly, so that heat is diffused at the inner layer, a partial overheated region is prevented from being formed on the outer shell in contact with users, and the using comfort of users is improved.

Description

technical field [0001] The invention relates to the field of devices, in particular to an electronic device. Background technique [0002] The quality of heat dissipation of electronic equipment directly affects its performance and user experience. The most common heat dissipation method for electronic equipment is to install a fan on the heating element. However, with the trend of thinner and lighter electronic equipment, this heat dissipation method may cause the case temperature to be too high due to the small space of thin and light electronic equipment, or because of the need to Increase the heat dissipation capacity and increase the fan speed, resulting in increased noise. In order to make thin and light electronic equipment dissipate heat better, heat-insulating or heat-conducting materials are currently used as the heat-dissipating layer between the heating element and the housing, but this has brought new problems: because some heating elements emit a large amount ...

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention provides an electronic device, which aims to solve the problem that the existing electronic device using a heat dissipation layer produces a local overheating area on the shell that is in contact with the user, resulting in poor user experience.

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