Base plate pre-alignment pose measuring method

A pose measurement and pre-alignment technology, applied in the direction of measuring devices, instruments, electrical components, etc., can solve the problem of low reproduction accuracy and achieve high reproduction accuracy

Active Publication Date: 2013-04-10
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The patent US6847730 needs to fit two sides separately, and the reproduction accuracy is low

Method used

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  • Base plate pre-alignment pose measuring method
  • Base plate pre-alignment pose measuring method
  • Base plate pre-alignment pose measuring method

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Experimental program
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Embodiment Construction

[0035] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0036] Use CCD or other image sensors to obtain the image of the substrate under test, refer to figure 2 As shown in , the convolution operation is performed through the vertical difference operator, and the resulting image is named edge. On the edge map, the gray value of most areas is 0 (or very small). in such as figure 1 There are some pixels whose gray level is greater than or less than 0 at the positive and negative positions. Ignore (set to 0) the part less than 0, that is, exclude the edge points from bright to dark from top to bottom, and only keep the points whose difference value is greater than 0, thus excluding the influence of negative edge points, and get the image edge11Pos ,Such as image 3 shown.

[0037] Horizontally project the edge11Pos image after binarization. Since photolithography will not be performed within 5m...

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PUM

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Abstract

A base plate pre-alignment pose measuring method comprises conducting difference on input images and removing negative peripheral points to obtain difference images; conducting difference image binaryzation and projecting and adopting non-maximum value restraining to confirm possible positions of base plate edges on two sides of the base plate in the images; searching the difference images in the vicinity and using a difference extreme point to serve as a candidate point of the base plate edges; rejecting noise in the candidate point of the base plate edges to obtain base plate edge points on two sides according to straightness characters of the base plate edges; judging whether the base plate edge points meet requirements for luminance consistency or not, on yes judgment, entering the sixth step, and on no judgment, skipping to the possible position of a next base plate edge in the images and returning to a step three; using two vertical sides of the base plate, calculating positions of the base plate after fitting a linear equation parameter of two sides of the base plate according to the base plate edge points, and calculating poses of the base plate after singly fitting a linear equation parameter of one side of the base plate.

Description

technical field [0001] The invention relates to the field of position measurement, in particular to a substrate pre-alignment pose measurement. Background technique [0002] In the information age, display is one of the important means to realize human-computer interaction. Especially nowadays with the vigorous development of various handheld devices, people not only have more and more demand for displays, but also have higher and higher requirements for the resolution of the display (the number of pixels per unit size), and the color fidelity and function of the display. Consumption puts forward higher requirements. In order to meet people's increasing demand, manufacturers must continuously improve their production processes. Alignment accuracy is one of the important indicators affecting the process. [0003] There are often deviations in the position after the substrate is placed on the board. In order to meet the overlay accuracy requirements, it needs to be pre-alig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/00H01L21/68
Inventor 杜荣徐兵陈跃飞徐涛
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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