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Device and method for measuring heat exchange coefficient of interface in hot stamp process

A technology of interface heat transfer coefficient and hot stamping, applied in the field of hot stamping of high-strength steel plates

Active Publication Date: 2015-02-04
滕州市产品质量监督检验所
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  • Abstract
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  • Application Information

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Problems solved by technology

[0013] Aiming at the current situation of the device and method for testing the interface heat transfer coefficient, the present invention discloses a test device suitable for the interface heat transfer coefficient between the high-temperature steel plate and the mold in the hot stamping process

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  • Device and method for measuring heat exchange coefficient of interface in hot stamp process
  • Device and method for measuring heat exchange coefficient of interface in hot stamp process
  • Device and method for measuring heat exchange coefficient of interface in hot stamp process

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Embodiment Construction

[0082] The present invention will be further described below in conjunction with the accompanying drawings.

[0083] A device for measuring the interface heat transfer coefficient between a high-temperature steel plate and a die during hot stamping, including a pressure applying device and a measuring device:

[0084] The pressurizing device includes a pressurizing device, an upper workbench and a lower workbench, and the pressurizing device is connected with the upper workbench and the lower workbench respectively; the measuring device includes an upper tooling, a lower tooling and a sample fixing tooling, The upper tooling is fixed on the upper worktable through the upper tooling fixing plate, and the lower tooling is fixed on the lower working table through the lower tooling fixing plate; the sample fixing tooling is arranged between the upper tooling and the lower tooling.

[0085] The upper tooling includes an upper tooling fixing plate 1, an elastic energy storage elemen...

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Abstract

The invention discloses a device for measuring a heat exchange coefficient of an interface between a high-temperature steel plate and a die in a hot stamp process. The device comprises a pressure applying device and a measurement device, wherein the pressure applying device comprises a pressurization device, an upper workbench and a lower workbench, wherein the pressurization device is connected with the upper workbench and the lower workbench respectively; the measurement device comprises an upper fixture, a lower fixture and a test sample fixing fixture; the upper fixture is fixed on the upper workbench; the lower fixture is fixed on the lower workbench; and the test sample fixing fixture is arranged between the upper fixture and the lower fixture. The invention also discloses a method for measuring the heat exchange coefficient of the interface between the high-temperature steel plate and the die in the hot stamp process. By the device and the method, the limitation to samples with the thickness being more than 30mm in the prior art is avoided; the heat exchange coefficient of the interface between the steel plate and the die in the hot stamp process can be measured; and by an elastic energy storage element, stabilization of interface pressures between a boron steel test sample and an upper die and between the boron steel test sample and a lower die can be guaranteed.

Description

technical field [0001] The invention relates to a device and method for measuring interface heat transfer coefficient, in particular to a method and device for testing interface heat transfer coefficient between steel and a mold during hot stamping, and belongs to the technical field of high-strength steel plate hot stamping. Background technique [0002] Inverse heat conduction problem (Inverse Heat Conduction Problem, IHCP) is an ill-posed problem, which is different from the conventional heat conduction process. The conventional heat conduction process is based on the known initial conditions or boundary conditions to solve the temperature change inside the heat transfer body, which is a well-posed problem. IHCP is to calculate the boundary conditions or initial conditions of the heat transfer body according to the temperature change of the heat transfer body; that is, install a thermal sensor inside the heat transfer body, use the thermal sensor to record the temperature...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20
Inventor 李辉平贺连芳赵国群
Owner 滕州市产品质量监督检验所
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