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Electrostatic chuck and method of using an electrostatic chuck

A technology of electrostatic chuck and electrostatic clamp, which is applied in the direction of holding device, clamping, circuit, etc., which applies electrostatic attraction, and can solve the problems of limited processing efficiency, low heat transfer rate, limited heating rate and cooling rate, etc.

Active Publication Date: 2016-04-06
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The inventors have discovered that due to the high thermal inertia of conventional ESCs (e.g. low heat transfer rates), the heating and cooling rates of ESCs are substantially limited, thereby limiting the efficiency of processes using ESCs

Method used

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  • Electrostatic chuck and method of using an electrostatic chuck
  • Electrostatic chuck and method of using an electrostatic chuck
  • Electrostatic chuck and method of using an electrostatic chuck

Examples

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Embodiment Construction

[0018] Embodiments of electrostatic chucks and methods of using the same are provided. Advantageously, the apparatus of the present invention can provide an electrostatic chuck that can be rapidly heated and cooled while rapidly heating and cooling a substrate placed on the electrostatic chuck, thereby providing a substrate Handling flexibility during processing and increased yield. Advantageously, the electrostatic chuck of the present invention can also reduce or eliminate damage to the substrate caused by friction due to thermal expansion differences between the substrate and the electrostatic chuck during processing.

[0019] figure 1 is a schematic cross-sectional view of a plasma processing chamber according to some embodiments of the present invention. In some embodiments, the plasma processing chamber is a physical vapor deposition (PVD) processing chamber. However, other types of processing chambers using electrostatic chucks may also be used with the apparatus of ...

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PUM

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Abstract

The present invention provides an electrostatic chuck and a method of using the same. In some embodiments, an electrostatic chuck can include a plate having a first side for supporting a substrate on the first side, and a second side, the second side opposite to the first side, to provide an interface for selectively coupling the disk to a thermal control plate; a first electrode disposed within the disk near the first side to The substrate is electrostatically coupled to the disc; and a second electrode is disposed within the disc near the opposite side of the disc to electrostatically couple the disc to the thermal control plate. In some embodiments, the second electrode may also be configured to heat the disk.

Description

technical field [0001] Embodiments of the invention generally relate to electrostatic chucks and methods of using the same. Background technique [0002] An electrostatic chuck (ESC) is commonly used to electrostatically hold a substrate on a substrate support. Traditionally, ESCs include a ceramic body with one or more electrodes disposed within the ceramic body. The inventors have discovered that due to the high thermal inertia of conventional ESCs (eg, low heat transfer rates), the heating and cooling rates of ESCs are substantially limited, thereby limiting the efficiency of processes using ESCs. [0003] Thus, the present inventors have provided an improved electrostatic chuck that can be heated and cooled rapidly. Contents of the invention [0004] Embodiments of electrostatic chucks and methods of using the same are provided. The present invention provides electrostatic chucks and methods of using the same. In some embodiments, an electrostatic chuck can include...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/687B23Q3/15H02N13/00
CPCH01L21/67103H01L21/67109H01L21/6831B23Q3/15H01L21/687
Inventor 尚布休·N·罗伊马丁·李·莱克基思·A·米勒维贾伊·D·帕克赫史蒂芬·V·桑索尼
Owner APPLIED MATERIALS INC