Apparatus
A technology of precursors and nozzle heads, which is applied to surface devices and treats the surface area of substrates, which can solve the problems of inability to withstand precursors uniformly, complex mechanical structure of nozzle heads, and large mechanical force.
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[0014] figure 1 A schematic diagram of one embodiment of an apparatus is shown for subjecting a surface 4 of a substrate 6 to successive surface reactions of at least a first precursor and a second precursor according to the principles of ALD. The apparatus comprises a nozzle head 2 having: one or more first precursor nozzles for subjecting a surface 4 of a substrate 6 to a first precursor; and one or more nozzles for subjecting the surface 4 of a substrate 6 to A second precursor nozzle subjected to a second precursor. The nozzle head 2 can also be provided with a plurality of purge gas nozzles and possibly a plurality of discharge nozzles, which are arranged between the respective precursor nozzles. However, it should be noted that by providing the precursor nozzle and the purge gas nozzle with discharge ports for discharging the precursor and purge gas, the discharge nozzle can be omitted. In one embodiment, the nozzle head 2 sequentially includes precursor nozzles, purge...
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