How to install electronic components
A technology for electronic components and installation methods, which is applied in the field of installing electronic components on circuit substrates, and can solve the problems of small bonding force between electronic components and pads, falling off of electronic components, poor electrical conduction performance between electronic components and pads, etc.
Active Publication Date: 2016-01-27
AVARY HLDG (SHENZHEN) CO LTD +1
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- Description
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- Application Information
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Problems solved by technology
However, during the process of melting the solder into a liquid state and cooling the solder, the solder will expand or shrink, and the electronic components will also move relative to the pads driven by the deformation of the solder, so that the contact area between the leads of the electronic components and the solder paste becomes smaller. Small, which not only makes the electrical conduction between the electronic component and the pad become poorer, but also makes the bonding force between the electronic component and the pad smaller, and the electronic component is more likely to fall off the pad when it is disturbed by an external force
Method used
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[0020] The method for installing electronic components provided by the technical solution will be further described in detail below in conjunction with multiple drawings and implementation manners.
[0021] The implementation mode of the technical solution provides a method for installing electronic components, including steps:
[0022] For a first step, see figure 1 , providing a circuit substrate 11. The circuit substrate 11 includes a base layer 111 , a protection layer 113 covering the base layer 111 , and at least two pads 115 mounted on the base layer 111 and distributed at intervals.
[0023] The base layer 111 is a multi-layer structure. A multi-layer structure refers to a structure comprising at least one insulating layer and at least one circuit layer arranged alternately, that is to say, the base layer 111 can be a single-sided circuit board, a double-sided circuit board or a multi-layer circuit on which conductive circuits are formed. plate. In this embodiment,...
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The invention relates to an installation method of an electronic element. The installation method includes: supplying a circuit substrate which comprises a base layer and at least two pads distributed on the base layer at intervals; respectively arranging welding flux on the at least two pads; supplying the electronic element which comprises at least two pins; placing the electronic element on the circuit substrate, wherein the at least two pins are respectively in one-to-one contact with the welding flux on the at least two pads; supplying a fixing jig which comprises a first metal mesh; overlaying the fixing jig on the circuit substrate, and covering the first metal mesh on the electronic element; melting the welding flux on the circuit substrate; cooling the welding flux and fixedly installing the two pins of the electronic element on the at least two pads of the circuit substrate, and removing the fixing jig from the circuit substrate.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for installing electronic components on a circuit board. Background technique [0002] Many electronic components (for example, active components or passive components) are installed on the circuit substrate to achieve specific electronic functions. Most of these electronic components are directly soldered on the pads of the circuit substrate by surface mount technology (SurfaceMountingTechnology). [0003] The installation process of general electronic components is as follows: the solder paste is set on each pad of the circuit substrate by stencil printing; the pins of each electronic component are placed on the corresponding solder paste; Melt the solder into a liquid state in an infrared reflow furnace; after taking out the circuit board, cool the solder to fix the pins of each electronic component on the corresponding pad. However, during the process of mel...
Claims
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IPC IPC(8): H05K3/34
Inventor 郑建邦
Owner AVARY HLDG (SHENZHEN) CO LTD