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Pick-place device for reaction source bottles

A technology of pick-and-place device and reaction source bottle, which is applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve problems such as inability to meet normal installation, and achieve the effect of reducing the impact of damage

Active Publication Date: 2015-01-21
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the direct installation type has certain limitations in taking and placing the reaction source bottle and the protection of the interface, because this direct installation type structure is difficult to easily disassemble the reaction source bottle and take it out for replacement, and further because the reaction source bottle mouth adopts a hard connection , although the source bottle can be disassembled after unscrewing, but the direct removal has a great impact on the damage of the connected interface, and for the multi-composite pipeline connection, the direct installation structure can no longer meet the needs of normal installation

Method used

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  • Pick-place device for reaction source bottles
  • Pick-place device for reaction source bottles
  • Pick-place device for reaction source bottles

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Embodiment Construction

[0025] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0026] In the embodiment of the present invention, a pick-and-place device for reaction source bottles is provided. The overall composition and structure are as follows: figure 1 As shown, includes the following structure:

[0027] The adjustment stud 4 and the adjustment support plate 5, wherein two adjustment studs 4 are required, which are respectively on both sides of the reaction source bottle 1. The adjusting stud 4 is threadedly connected with the adjusting support plate 5, and the lifting position of the adjusting support plate 5 is controlled by adjusting the thread position of the adjusting stud 4, thereby adjusting the lifting position of the reaction source bo...

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Abstract

The invention discloses a pick-place device for reaction source bottles. The device comprises two adjusting studs and an adjusting support plate. The adjusting studs are threadedly connected with the adjusting support plate. The elevation of the adjusting support plate is adjusted through the adjustment in the thread position of the adjusting studs. The device also comprises a guiding shaft sleeve, a guiding shaft, and a guiding shaft fixing screw. The guiding shaft sleeve is sleeved on the guiding shaft, and the guiding shaft slides in the guiding shaft sleeve. The guiding shaft fixing screw is used for fixing the guiding shaft. The device also comprises a guide rail, a guide rail fixing plate, and a guide rail supporting plate. When a reaction source bottle interface connection is released, the adjusting studs can be adjusted; the guide rail fixing plate is drawn out, and reaction source bottle can be easily fetched. The damage to the bottle port caused by improper operations during the fetching process can be reduced. With the stable and smooth guide rail, the reaction source bottle slides out, such that a positive turbulence effect is caused to fluid in the reaction source bottle, such that requirements by reaction bottle mounting and maintenance are facilitated. The device provided by the invention has the advantages such as perfect structure, high integrity, flexible control, good adjustment effect, and the like.

Description

technical field [0001] The invention relates to the field of installation technology of semiconductor equipment, in particular to a pick-and-place device for reaction source bottles. Background technique [0002] At present, most of the reaction source bottles used in semiconductor process equipment adopt a direct installation structure. When the process is completed and the reaction source bottle needs to be replaced, the reaction source bottle needs to be disassembled and replaced. However, the direct installation type has certain limitations in taking and placing the reaction source bottle and the protection of the interface, because this direct installation type structure is difficult to easily disassemble the reaction source bottle and take it out for replacement, and further because the reaction source bottle mouth adopts a hard connection , although the source bottle can be disassembled after unscrewing, the direct removal has a great impact on the damage of the conne...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/44C23C16/448C23C16/455
Inventor 兰云峰龙睿芬李一吾苏艳波
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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