Composite ceramic substrate and preparation method thereof

A technology for composite ceramics and substrates, which is applied in the preparation of composite ceramic substrates and the field of composite ceramic substrates, and can solve problems such as poor thermal conductivity

Inactive Publication Date: 2013-06-26
KUANG CHI INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the poor thermal conductivity of silica airgel, in order to meet the heat dissipation requirements of some substrates, it is necessary to improve the thermal conductivity of silica airgel ceramic substrates

Method used

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  • Composite ceramic substrate and preparation method thereof
  • Composite ceramic substrate and preparation method thereof
  • Composite ceramic substrate and preparation method thereof

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Embodiment Construction

[0056] The technical solutions of the present invention will be described in detail below in combination with preferred embodiments of the present invention.

[0057] It should be understood that the following descriptions (including the accompanying drawings) are only exemplary rather than limiting descriptions of the present invention. In the following description, the specific quantity or ratio of parts and raw materials will be involved, but it should also be understood that these quantities or ratios are only exemplary, and those skilled in the art can arbitrarily choose parts with appropriate quantity or ratio with reference to the present invention ,raw material. Moreover, words such as "first" and "second" mentioned in the present invention do not indicate the ranking of the importance of the components, but are only used to distinguish the names of the components.

[0058] Unless otherwise clearly defined, terms used in the context of the present application have mea...

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Abstract

The invention provides a composite ceramic substrate which comprises an insulating substrate material with low heat conductivity and insulating filler with high heat conductivity. The filler in the composite ceramic substrate is large enough to affect the integral heat conductivity of the composite ceramic substrate. The invention further provides a method for preparing the composite ceramic substrate. The composite ceramic substrate prepared by the invention has the characteristics of insulation, light weight, no toxicity, flame retardance, high heat conductive performance and the like.

Description

【Technical field】 [0001] The present invention relates to the field of electronic packaging, in particular to a composite ceramic substrate and a method for preparing the composite ceramic substrate. 【Background technique】 [0002] Electronic packaging products are the protective covers of electronic products, which protect electronic products from the influence of the external environment, such as chemical corrosion, oxidation and so on. In order to make electronic products more durable and improve their lifespan, electronic packaging technology is very important. With the rapid development of electronic technology, the miniaturization of packaging and the high density of assembly, as well as the continuous emergence of various new packaging technologies, the quality requirements for electronic packaging are also getting higher and higher. [0003] In power electronic packaging, the electronic packaging substrate should have the characteristics of high thermal conductivity...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/14C04B35/622
Inventor 刘若鹏赵治亚李雪金曦缪锡根
Owner KUANG CHI INST OF ADVANCED TECH
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