Unlock instant, AI-driven research and patent intelligence for your innovation.

Method to optimize and reduce integrated circuit, package design, and verification cycle time

An integrated circuit, integrated technology used in the field of optimizing and reducing integrated circuit, package design and inspection cycle time, which can solve problems such as long development cycle time and doubling of resources

Inactive Publication Date: 2013-06-26
QUALCOMM INC
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to support IC chips for two different products, resources need to be doubled, or the development cycle time will be longer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method to optimize and reduce integrated circuit, package design, and verification cycle time
  • Method to optimize and reduce integrated circuit, package design, and verification cycle time
  • Method to optimize and reduce integrated circuit, package design, and verification cycle time

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] figure 1 One embodiment of a method by which an integrated circuit product may be designed and manufactured is illustrated in flowchart 10 of the figure 1 . As shown in block 12, an integrated circuit package is designed having a plurality of integrated circuit connection sets. An example connection set is described in more detail below in conjunction with Figures 4-6. Each of the set of integrated circuit connections is configured to connect to a corresponding one selected from among a plurality of integrated circuits, each having a different functionality, such that depending on which selected integrated circuit Connect to their corresponding connection sets to produce different integrated circuit products.

[0026] For example, the set of connections may be a metallization trace or pattern formed in a well-known manner. However, the metallization pattern is formed in such a way that the metallization pattern can be segmented or separated during the design phase, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for fabricating an integrated circuit (IC) product and IC product formed thereby. The method includes designing an IC package having a plurality of IC connection sets, each configured to be connected to a corresponding IC selected from among a plurality of ICs, each having different functionality. Various IC products can be produced depending upon which selected IC is connected to its corresponding connection set, and the IC package can be cut during design to exclude IC connection sets corresponding to ICs that are not selected. By testing the complete IC package, a portion of the complete IC package can be fabricated, cut from the complete IC package, with significantly reduced design and testing requirements.

Description

[0001] Various embodiments described herein relate generally to improvements in integrated circuit packaging, and more particularly to methods and apparatus for deploying integrated circuit chips in multiple packages that may be considered different products. Background technique [0002] The design of integrated circuit (IC) products involves difficult and complex processes. For example, an IC customer may require an IC product with certain functionality that can be implemented with one or more pre-existing packaged ICs. In this context, new or "combined" IC packages are sometimes designed on or in which pre-existing IC packages are combined and interconnected. The new IC package is in turn passed to the customer to be connected in the customer's specific application. The overall goal of the package designer is to deliver IC packages with multiple circuit functionalities as quickly, efficiently, and as economically as possible. [0003] However, meeting these goals presents...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/39G06F2113/18H01L2224/16227H01L2924/15311G06F17/00H01L2924/1532
Inventor 瑞安·D·莱恩瑞·凯·詹
Owner QUALCOMM INC