Testing structure and testing method for micro-machine residual stress
A technology for testing structure and residual stress, applied in the direction of measuring force, measuring device, instrument, etc., can solve the problems of warping of thin film structure, affecting the adhesion of thin film, affecting the performance of MEMS device, etc., to achieve the effect of improved accuracy and high precision
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[0026] The present invention will be further described below in conjunction with the accompanying drawings.
[0027] Such as figure 1 Shown is a micromechanical residual stress test structure, including four sets of micromechanical beam test structures with identical structural size parameters; the micromechanical beam test structure includes a pointer beam and two test beams with identical structural size parameters , the two test beams are parallel to each other and perpendicular to the pointer beam, the intersection between the pointer beam and the test beam is recorded as the rotation point; all the pointer beams and test beams of the four sets of micromechanical beam test structures are located at In the same vertical plane; record the pointer beams of the four sets of micromechanical beam test structures as No. 1 pointer beam, No. 2 pointer beam, No. 3 pointer beam and No. 4 pointer beam; the No. 1 pointer beam, No. 2 pointer beam Beam, No. 3 pointer beam and No. 4 poin...
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