Laser rotating direct-exposure imaging device and method used for revolution surface

Abstract

The invention discloses a laser rotating direct-exposure imaging device and method used for a revolution surface. The laser rotating direct-exposure imaging device comprises a rotating spindle for driving a workpiece to continuously rotate, a laser, an axial moving trolley for driving the laser to move back and forth, a vertical moving supporting plate for adjusting the spacing between corresponding exposure points on the outer surfaces of the laser and the workpiece, and a laser beam projection direction adjusting part installed on the vertical moving supporting plate. The method comprises the steps of: 1. establishment of a three-dimensional model of the revolution surface; 2. determination of control parameters of a mechanical structure; 3. determination of control parameters of the laser; 4. treatment on the outer surface of the workpiece to be machined; 5. installation of the workpiece and the laser; and 6. exposure imaging. The laser rotating direct-exposure imaging device and method are reasonable in design, low in input cost, simple and convenient to use and operate, good in using effect and wide in application range, and can effectively solve the problems of poor diagram accuracy, low repeated accuracy, low machining efficiency, high rejection rate, incapability of machining complex revolution surfaces and the like of a conventional revolution surface chemical etching method.

Description

technical field [0001] The invention belongs to the technical field of chemical etching processing, and in particular relates to a laser rotation direct exposure imaging device and method for a rotary surface. Background technique [0002] In the field of modern processing technology, chemical etching processing of graphics on the surface of materials is a widely used technical means, such as the processing and manufacturing of printed circuit boards and nameplates. Among them, the basic process of traditional chemical etching processing is roughly as follows: [0003] The first step, negative plate making: use a photoplotter or an phototypesetter to make a photographic negative that needs to be etched; [0004] The second step, photosensitive adhesive coating: apply photosensitive resist or paste photosensitive resist film on the surface of the material; [0005] The third step, negative film paste: Since the negative film is a flat material, it cannot be tightly attached...

AI Technical Summary

Problems solved by technology

Therefore, in the actual operation process, the above-mentioned traditional chemical etching method has the following main serious defects, and sometimes it is even inoperable:

[0010] First, poor graphics accuracy: due to the need for manual splicing, positioning, and pasting of the film, the graphics splicing accuracy is extremely low, which cannot meet the processing requirements of high-precision graphics;

[0011] Second, the repetition accuracy is low: the manual splicing and pasting of a large number of small films produces cumulative errors, resulting in product repeatability and consistency deviations;

[0012] Third, low efficiency, high cost and high scrap rate: Since the splicing and pasting of the film needs to be manually operated, and it is one-time use, the production efficiency is extremely low, the scrap rate is high, and the cost is high;

[0013] Fourth, complex curved surfaces or complex graphics cannot be processed: for complex curved surfaces, the film must be divided into very small areas of film, so that it is completely impossible to achieve

And complex, high-precision graphics are even more inoperable

[0014] In summary, the chemical etching of high-precision and complex graphics on three-dimensional curved surfaces has always been a difficult point in processing technology. There is no good processing method, which cannot meet the requirements of modern industry, especially military industry.

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