A kind of probe card maintenance method
A probe card and acupuncture technology, which is applied in the field of probe card maintenance, can solve problems such as unbalanced and inability to solve the problem of probe card use, and achieve the effect of avoiding waste and solving the problem of unbalanced use of probe cards
Active Publication Date: 2015-08-19
SHANGHAI HUALI MICROELECTRONICS CORP
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- Application Information
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Problems solved by technology
[0011] This invention can improve the efficiency of probe card testing, but cannot solve the problem of unbalanced use of probe cards
Method used
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Embodiment Construction
[0034] The invention is a method for maintaining a probe card, more specifically a method for automatically maintaining the probe card.
[0035] The method of the invention is realized based on a probe card testing system, which includes an information collection terminal, a central processing terminal and a setting storage terminal. The probe card test system also includes an information output terminal, which can output necessary data such as the limit of scrapped needling times, the limit of maintained needling times, the current actual needling times, and the current accumulated needling times. Engineers can output the necessary data according to the information. The output data of the terminal is used to monitor the operation status of the probe card.
[0036] The probe card testing system also includes a first database and a second database. Among them, the first database stores the original number of needle sticks, the original number of needle sticks is the number of ...
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The invention provides a probe card maintaining method. The probe card maintaining method comprises the following steps: setting a probe inserting failure time limiting value of a probe card and a probe inserting maintaining time limiting value; acquiring the actual probe inserting times of the probe card; adding the actual probe inserting times and original accumulated probe inserting times to obtain current accumulated probe inserting times; replacing the probe card if the value of the current accumulated probe inserting times is larger than or equal to the probe inserting failure time limiting value, and meanwhile setting the value of the original probe inserting times and the value of the original accumulated probe inserting times to be zero; updating the value of the original accumulated probe inserting times to be the value of the current accumulated probe inserting times, and continuing adding the actual probe inserting times and the original probe inserting times to obtain the current probe inserting times if the value of the current accumulated probe inserting times is smaller than the probe inserting failure time limiting value; maintaining the probe card if the value of the current probe inserting times is larger than or equal to the probe inserting maintaining time limiting value, and setting the value of the original probe inserting times to be zero; and updating the value of the original probe inserting times to be the value of the current probe inserting times if the value of the current probe inserting times is smaller than the probe inserting maintaining time limiting value. The probe card maintaining method solves the problem of waste in maintaining of the probe card.
Description
technical field [0001] The invention relates to the field of semiconductor test equipment maintenance, in particular to a probe card maintenance method. Background technique [0002] Using probe cards to test semiconductor devices is a very common method in today's semiconductor device testing. The test using the probe card is an electrical parameter test performed on the silicon integrated circuit for specification compliance. By using the probe card to test the silicon chip, the defects of the tested silicon chip can be found, and the defective silicon chip can be avoided. At the same time, when defective silicon wafers are found, the data can be fed back to semiconductor engineers, so that problems in the manufacturing process can be found and corrected. [0003] Silicon wafers are installed on printed circuit boards (PCBs) after production is complete. When the printed circuit boards are produced, if problems are found in the inspection of the PCB, an extremely complica...
Claims
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IPC IPC(8): G01R1/06
Inventor 沈茜周波
Owner SHANGHAI HUALI MICROELECTRONICS CORP