chemical mechanical grinding equipment
A technology of chemical machinery and equipment, which is applied in the field of chemical mechanical grinding equipment, can solve the problems of unfinished semiconductor substrate grinding and increased semiconductor substrate defects, and achieve the effect of reducing waiting time and reducing defects
Active Publication Date: 2016-06-01
SHANGHAI HUALI MICROELECTRONICS CORP
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Problems solved by technology
If existing copper chemical mechanical polishing equipment is used, a problem will be produced: when the semiconductor substrate of the third grinding pad 3 has been ground, the semiconductor substrate on the first grinding pad 1 and the second grinding pad 2 has not been ground yet. complete
However, due to equipment limitations, the semiconductor substrate on the third grinding pad 3 cannot be transferred to the grinding head cleaning device 4 immediately, and then transferred to the cleaning tank for cleaning, but can only wait for the first grinding pad 1 and the second grinding pad 2 The transfer can only be carried out after the semiconductor substrates on the
As mentioned earlier, if the waiting time is too long when changing the pad, it will cause more defects on the semiconductor substrate.
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[0018] The inventors have found that the waiting time required for switching the polishing head between different polishing pads can cause defects on the semiconductor substrate. In order to reduce the waiting time for the conversion of the polishing pad and reduce the defects of the semiconductor substrate due to waiting, the invention provides a chemical mechanical polishing equipment, which includes a polishing head cleaning device, a plurality of polishing pads, and a plurality of polishing heads, and also includes: an annular frame, and the grinding head can move independently between each grinding pad along the ring frame.
[0019] The technical solutions of the present invention will be described in detail below in conjunction with specific embodiments. In order to better illustrate the technical solution of the present invention, please combine figure 2 A schematic structural diagram of a chemical mechanical polishing device according to a technical solution of the p...
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The invention provides a chemical machinery polishing device. The chemical machinery polishing device comprises a polishing head cleaning device, a plurality of polishing pads, a plurality of polishing head, and further comprises a ring-shaped framework, wherein the polishing heads can perform independent movement among all polishing pads along the ring-shaped framework. The chemical machinery polishing device provided by the invention can reduce waiting time for the polishing pads, and can reduce defects of a semiconductor substrate, which are caused by waiting.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to chemical mechanical polishing equipment. Background technique [0002] With the continuous shrinking of the feature size of semiconductor devices, the connection resistance of the wiring between semiconductor devices is also continuously reduced, and the traditional aluminum wiring can no longer meet the performance requirements. At present, in the advanced process, the back-end metal process wiring material has changed from the original aluminum to copper. Since the characteristics of copper itself are not suitable for the formation of wiring layers by dry etching, the so-called "double damascene" process can only be used to realize metal wiring, that is, the lower metal contact holes and wiring grooves are first etched in the dielectric layer. Then use electroplating method to electroplate metal copper in the contact holes and wiring grooves, and finally use chemical me...
Claims
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IPC IPC(8): B24B37/10B24B37/34
Inventor 邓镭
Owner SHANGHAI HUALI MICROELECTRONICS CORP