A two-phase immersion cooling device, communication equipment and manufacturing method thereof

A heat dissipation device and heat source technology, which is applied in the construction of electrical equipment components, cooling/ventilation/heating transformation, instruments, etc., to achieve the effect of solving high-density heat dissipation problems

Inactive Publication Date: 2016-09-07
HUAWEI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Embodiments of the present invention provide a two-phase immersion cooling device, communication equipment and a manufacturing method thereof, which are used to solve the problem of how to effectively dissipate heat through immersion cooling technology

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  • A two-phase immersion cooling device, communication equipment and manufacturing method thereof
  • A two-phase immersion cooling device, communication equipment and manufacturing method thereof
  • A two-phase immersion cooling device, communication equipment and manufacturing method thereof

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Embodiment Construction

[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments . Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] In the schematic diagram of the embodiment of the present invention, the black in the rectangular sealed shell The schematic diagram shows the heat source device and the single board, and will not be explained one by one in the description of the subsequent schematic diagram.

[0030] An embodiment of the present invention provides a two-phase immersion cooling device, such as figure 1 shown, please also see Figure 2-4 ,include:...

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Abstract

Disclosed are a two-phase immersion heat radiation device, a communication device and a manufacturing method therefor. The heat radiation device comprises seal housings (101), pipelines (102) and a condenser (103). The seal housings (101) are connected to the condenser (103) through the pipelines (102); the cavities of the seal housings (101) are used for housing an insulating actuating medium and a heat source device; the pipelines (102) are used for connecting the seal housings (101) to the condenser (103) to enable the cavities of the seal housings (101) and the cavities of the condenser (103) to form closed loops; the condenser (103) is located above the seal housings (101); and a wall surface of each of the seal housings (101) is also provided with a connector which is used for electrically connecting the interior of the seal housing (101) to the exterior of the seal housing (101). The solution can not only solve a high-density heat radiation problem, but also can meet the requirements of different application scenarios. The solution is a smooth evolution solution.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a two-phase immersion heat dissipation device, communication equipment and a manufacturing method thereof. Background technique [0002] With the rapid development of the Information Communication Technology (ICT) industry, the integration and thermal density of equipment are getting higher and higher. Moore's Law tells us that the performance and integration of chips will double every 18 months. From the perspective of equipment integration, although the heat dissipation capacity of most data centers or core computer rooms is still at the level of 3kW / cabinet, it is not surprising that there are 20kW equipment in a single cabinet. Faced with the increasing power consumption of chips and the increasing integration of equipment, the traditional technology of using air as the medium to dissipate heat for electronic products is increasingly unable to meet the demand. The in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20H01L23/34H05K7/20
CPCH05K7/203H01L23/427H01L2924/0002
Inventor 罗朝霞黄书亮翟立谦柯有和
Owner HUAWEI TECH CO LTD
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